參數(shù)資料
型號： MC56F8147VVFE
廠商： Freescale Semiconductor
文件頁數(shù)： 62/172頁
文件大?。?/td> 0K
描述： IC DGTL SIGNAL CTLR 160-MAPBGA
標(biāo)準(zhǔn)包裝： 126
系列： 56F8xxx
核心處理器： 56800E
芯體尺寸： 16-位
速度： 40MHz
連通性： EBI/EMI，SCI，SPI
外圍設(shè)備： POR，PWM，WDT
輸入/輸出數(shù)： 76
程序存儲器容量： 128KB（64K x 16）
程序存儲器類型： 閃存
RAM 容量： 4K x 16
電壓 - 電源 (Vcc/Vdd)： 2.25 V ~ 3.6 V
數(shù)據(jù)轉(zhuǎn)換器： A/D 16x12b
振蕩器型： 外部
工作溫度： -40°C ~ 105°C
封裝/外殼： 160-BGA
包裝： 托盤
56F8347 Technical Data, Rev.11
154
Freescale Semiconductor
Preliminary
10.17 Equivalent Circuit for ADC Inputs
Figure 10-23 illustrates the ADC input circuit during sample and hold. S1 and S2 are always open/closed
at the same time that S3 is closed/open. When S1/S2 are closed & S3 is open, one input of the sample and
hold circuit moves to VREFH - VREFH / 2, while the other charges to the analog input voltage. When the
switches are flipped, the charge on C1 and C2 are averaged via S3, with the result that a single-ended
analog input is switched to a differential voltage centered about VREFH - VREFH / 2. The switches switch
on every cycle of the ADC clock (open one-half ADC clock, closed one-half ADC clock). Note that there
are additional capacitances associated with the analog input pad, routing, etc., but these do not filter into
the S/H output voltage, as S1 provides isolation during the charge-sharing phase.
One aspect of this circuit is that there is an on-going input current, which is a function of the analog input
voltage, VREF and the ADC clock frequency.
1.
Parasitic capacitance due to package, pin-to-pin and pin-to-package base coupling; 1.8pf
2.
Parasitic capacitance due to the chip bond pad, ESD protection devices and signal routing; 2.04pf
3.
Equivalent resistance for the ESD isolation resistor and the channel select mux; 500 ohms
4.
Sampling capacitor at the sample and hold circuit. Capacitor C1 is normally disconnected from the input and is only
connected to it at sampling time; 1pf
Figure 10-23 Equivalent Circuit for A/D Loading
10.18 Power Consumption
This section provides additional detail which can be used to optimize power consumption for a given
application.
Power consumption is given by the following equation:
A, the internal [static component], is comprised of the DC bias currents for the oscillator, PLL, and voltage
references. These sources operate independently of processor state or operating frequency.
B, the internal [state-dependent component], reflects the supply current required by certain on-chip
resources only when those resources are in use. These include RAM, Flash memory and the ADCs.
Total power =
A: internal [static component]
+B: internal [state-dependent component]
+C: internal [dynamic component]
+D: external [dynamic component]
+E: external [static]
1
2
3
Analog Input
4
S1
S2
S3
C1
C2
S/H
C1 = C2 = 1pF
(VREFH - VREFLO) / 2
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