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參數(shù)資料
| 型號： | MC56603AGC60 |
| 廠商： | FREESCALE SEMICONDUCTOR INC |
| 元件分類： | 數(shù)字信號處理 |
| 英文描述： | 24-BIT, 60 MHz, OTHER DSP, PBGA144 |
| 封裝： | PLASTIC, BGA-144 |
| 文件頁數(shù)： | 84/97頁 |
| 文件大?。?/td> | 1080K |
| 代理商： | MC56603AGC60 |
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MOTOROLA
DSP56603A Technical Data Sheet
4-1
SECTION
4
DESIGN CONSIDERATIONS
THERMAL DESIGN CONSIDERATIONS
An estimation of the chip junction temperature, TJ, in C can be obtained from the
equation:
Equation 1:
Where:
TA
=
ambient temperature C
RqJA = package junction-to-ambient thermal resistance C/W
PD
=
power dissipation in package
Historically, thermal resistance has been expressed as the sum of a junction-to-case
thermal resistance and a case-to-ambient thermal resistance:
Equation 2:
Where:
RqJA = package junction-to-ambient thermal resistance C/W
RqJC = package junction-to-case thermal resistance C/W
RqCA = package case-to-ambient thermal resistance C/W
RqJC is device-related and cannot be influenced by the user. The user controls the
thermal environment to change the case-to-ambient thermal resistance, RqCA. For
example, the user can change the air flow around the device, add a heat sink, change
the mounting arrangement on the Printed Circuit Board (PCB), or otherwise change
the thermal dissipation capability of the area surrounding the device on the PCB. This
model is most useful for ceramic packages with heat sinks; some 90% of the heat flow
is dissipated through the case to the heat sink and out to the ambient environment.
For ceramic packages, in situations where the heat flow is split between a path to the
case and an alternate path through the PCB, analysis of the device thermal
performance may need the additional modeling capability of a system level thermal
simulation tool.
The thermal performance of plastic packages is more dependent on the temperature
of the PCB to which the package is mounted. Again, if the estimations obtained from
T
J
T
A
P
D
RqJA
()
+
=
RqJA
RqJC RqCA
+
=
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Freescale Semiconductor, Inc.
For More Information On This Product,
Go to: www.freescale.com
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