with I2C Control and Diagnostic<" />
參數(shù)資料
型號: MAX13326GUI/V+T
廠商: Maxim Integrated Products
文件頁數(shù): 12/21頁
文件大小: 0K
描述: IC AUD LINE DVR DL AUTO 28TSSOP
其它有關(guān)文件: Automotive Product Guide
產(chǎn)品培訓(xùn)模塊: Lead (SnPb) Finish for COTS
Obsolescence Mitigation Program
標(biāo)準(zhǔn)包裝: 2,500
類型: 線路驅(qū)動器,發(fā)射器
應(yīng)用: 車載音頻
安裝類型: 表面貼裝
封裝/外殼: 28-SOIC(0.173",4.40mm 寬)裸露焊盤
供應(yīng)商設(shè)備封裝: 28-TSSOP 裸露焊盤
包裝: 帶卷 (TR)
2
Maxim Integrated
Dual Automotive, Audio Line Drivers
with I2C Control and Diagnostic
MAX13325/MAX13326
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional
operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect device reliability.
VDD to PGND ........................................................-0.3V to +28V
CHOLD .................................................................-0.3V to +28V
VL to GND ...............................................................-0.3V to +6V
GND, PGND ........................................................-0.3V to +0.3V
OUT_ to PGND........................................................ -0.3V to 28V
IN_, BIAS to AGND ..................................-0.3V to (VDD + 0.3V)
SCL, SDA, ADD0, ADD1, MUTE, SHDN,
FLAG to GND ..........................................................-0.3V to +6V
OUT_ Short Circuit to PGND or VDD.........................Continuous
Short Circuits Between Any OUT_ ............................Continuous
Continuous Power Dissipation (TA = +70NC) (multilayer board)
28-Pin TSSOP (derate 27mW/NC above +70NC).....2162.2mW
Operating Temperature Range........................ -40NC to +105NC
Storage Temperature Range............................ -65NC to +150NC
Junction Temperature .....................................................+150NC
Lead Temperature (soldering, 10s) ................................+300NC
Soldering Temperature (reflow) ......................................+260NC
ELECTRICAL CHARACTERISTICS
(VDD = 14.4V, VL = 5V, RL = J, load impedance from OUT_+ to OUT_-, TA = TJ = -40NC to +105NC, typical values are TA = +25NC,
unless otherwise noted.) (Note 2)
ABSOLUTE MAXIMUM RATINGS
Note 1: Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-layer
board. For detailed information on package thermal considerations, refer to www.maximintegrated.com/thermal-tutorial.
Junction-to-Ambient Thermal Resistance (
qJA) ..........37°C/W
Junction-to-Case Thermal Resistance (
qJC) .................2°C/W
PACKAGE THERMAL CHARACTERISTICS (Note 1)
PARAMETER
SYMBOL
CONDITIONS
MIN
TYP
MAX
UNITS
AMPLIFIER DC CHARACTERISTICS
Transient Supply Voltage
(Load Dump)
VDDMAX
Using external nMOS-RTR020N05, 300ms
duration
50
V
Operating Supply Voltage Range
VDD
4.5
18
V
VL
2.7
5.5
VDD OVLO Threshold
VDDOV
Rising edge
18.5
19.2
V
VDD UVLO Threshold
VDDUV
Falling edge
3.3
3.5
V
VL UVLO Threshold
VLUV
Falling edge
2.2
2.4
V
Supply Current
IDD
TA = +25NC, no load
39
mA
TA = -40NC to +105NC, no load
50
mA
Logic Supply Current
IL
VL = 5V
1.7
mA
Shutdown Supply Current
ISHDN
IDD
TA = +25NC
0.5
10
F
A
TA = -40NC to +105NC
0.5
IL
< 0.1
2
F
A
Turn-On Time (from Shutdown)
MUTE = VL
220
ms
Turn-On Time (from Mute)
SHDN = VL, CCSS = 220nF
6
ms
Differential Input Resistance
RINDIF
Measure across input
18
24
30
kI
Single-Ended Input Impedance
RIN
Each input to ground (MAX13325)
15
20
25
kI
Each input to ground (MAX13326)
12
16
20
Signal-Path Gain (Note 3)
AV
MAX13325
11.8
12
12.2
dB
MAX13326
-0.2
0
+0.2
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