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| 型號： | M-ORT82G51BM680-DB |
| 廠商： | LATTICE SEMICONDUCTOR CORP |
| 元件分類： | FPGA |
| 英文描述： | FPGA, 1296 CLBS, 333000 GATES, PBGA680 |
| 封裝： | PLASTIC, FBGA-680 |
| 文件頁數(shù)： | 91/94頁 |
| 文件大?。?/td> | 2104K |
| 代理商： | M-ORT82G51BM680-DB |
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Lattice Semiconductor
ORCA ORT82G5 Data Sheet
91
ΘJB
This is the thermal resistance from junction to board. It is dened by:
(4)
where TB is the temperature of the board adjacent to a lead measured with a thermocouple. The other parameters
on the right-hand side have been dened above. This is considered a true thermal resistance, and the measure-
ment is made with a water-cooled heat sink pressed against the board to draw most of the heat out of the leads.
Note that ΘJB is expressed in units of °C/W and that this parameter and the way it is measured are still being dis-
cussed by the JEDEC committee.
FPSC Maximum Junction Temperature
Once the power dissipated by the FPSC has been determined, the maximum junction temperature of the FPSC
can be found. This is needed to determine if speed derating of the device from the 85 °C junction temperature used
in all of the delay tables is needed. Using the maximum ambient temperature, TAmax, and the power dissipated by
the device, Q (expressed in °C), the maximum junction temperature is approximated by:
(5)
Table 33. lists the thermal characteristics for all packages used with the ORCA ORT82G5 Series of FPSCs.
Package Thermal Characteristics
Table 33. ORCA ORT82G5 Plastic Package Thermal Guidelines
Package Coplanarity
The coplanarity limits of the Lattice packages are as follows:
PBGAM: 8.0 mils
Heat Sink Vendors for BGA Packages
The estimated worst-case power requirements for the ORT82G5 are in the 4 W to 5 W range. Consequently, for
most applications an external heat sink will be required. The following table lists, in alphabetical order, heat sink
vendors who advertise heat sinks aimed at the BGA market.
Table 34. Heat Sink Vendors
Package
Θ
ΘJA (°C/W)
Maximum Power
0 fpm
200 fpm
500 fpm
T = 70 °C Max, TJ = 125 °C Max, 0 fpm
680-Pin PBGAM*
9.8
7.8
6.8
4.1
Note: The 680-pin PBGAM package for the ORT82G5 includes a heat spreader.
Vendor
Location
Phone
Aavid Thermal Technology
Laconia, NH
(603) 527-2152
Chip Coolers
Warwick, RI
(800) 227-0254
IERC
Burbank, CA
(818) 842-7277
R-Theta
Buffalo, NY
(800) 388-5428
Sanyo Denki
Torrance, CA
(310) 783-5400
Thermalloy
Dallas, TX
(214) 243-4321
Wakeeld Engineering
Wakeeld, MA
(617) 246-0874
ΘJB =
TJ – TB
Q
TJmax = TAmax + (Q ΘJB)
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