參數資料
型號: LPC3220FET296
廠商: NXP SEMICONDUCTORS
元件分類: 微控制器/微處理器
英文描述: ARM926EJ-S with 128 kB SRAM, USB High-speed OTG, SD-MMC, NAND flash controller
中文描述: 32-BIT, FLASH, 266 MHz, RISC MICROCONTROLLER, PBGA296
封裝: 15 X 15 MM, 0.70 MM PITCH, PLASTIC, MO-216, SOT1048-1, TFBGA-296
文件頁數: 45/79頁
文件大?。?/td> 599K
代理商: LPC3220FET296
LPC3220_30_40_50
All information provided in this document is subject to legal disclaimers.
NXP B.V. 2011. All rights reserved.
Product data sheet
Rev. 2 — 20 October 2011
45 of 79
NXP Semiconductors
LPC3220/30/40/50
16/32-bit ARM microcontrollers
9. Limiting values
[1]
The following applies to
Table 7
:
a) This product includes circuitry specifically designed for the protection of its internal devices from the damaging effects of excessive
static charge. Nonetheless, it is suggested that conventional precautions be taken to avoid applying greater than the rated
maximum.
b) Parameters are valid over operating temperature range unless otherwise specified. All voltages are with respect to V
SS
unless
otherwise noted.
[2]
Core, PLL, oscillator, and RTC supplies; applies to pins VDD_CORE, VDD_COREFXD, VDD_OSC, VDD_PLL397, VDD_PLLHCLK,
VDD_PLLUSB, VDD_RTC, VDD_RTCCORE, and VDD_RTCOSC.
[3]
I/O pad supply; applies to domains VDD_EMC.
[4]
Applies to VDD_AD pins.
[5]
Applies to pins in the following domains VDD_IOA, VDD_IOB, VDD_IOC, and VDD_IOD.
[6]
Including voltage on outputs in 3-state mode.
[7]
Based on package heat transfer, not device power consumption. Calculated package thermal resistance (Theta
JA
): 35.766
C/W (with
JEDEC Test Board and 0 m/s airflow,
15 % accuracy).
[8]
Human body model: equivalent to discharging a 100 pF capacitor through a 1.5 k
series resistor.
[9]
Charge device model per AEC-Q100-011.
Table 7.
In accordance with the Absolute Maximum Rating System (IEC 60134).
[1]
Symbol
Parameter
V
DD(1V2)
supply voltage (1.2 V)
V
DD(EMC)
external memory controller
supply voltage
V
DDA(3V3)
analog supply voltage (3.3 V)
V
DD(IO)
input/output supply voltage
V
IA
analog input voltage
V
I
input voltage
Limiting values
Conditions
Notes Min
Max
+1.4
+4.6
Unit
V
V
[2]
0.5
[3]
0.5
[4]
0.5
+4.6
+4.6
+4.6
+2.4
+4.6
100
100
+150
1.12
V
V
V
V
V
mA
mA
C
W
[5]
0.5
0.5
1.8 V pins
3.3 V pins
per supply pin
per ground pin
[6]
0.5
[6]
0.5
-
-
65
I
DD
I
SS
T
stg
P
tot(pack)
supply current
ground current
storage temperature
total power dissipation
(per package)
electrostatic discharge voltage
max. junction temp 125
C
max. ambient temp 85
C
HBM
CDM
[7]
-
V
ESD
[8]
-
2500
1000
V
V
[9]
-
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