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參數(shù)資料
| 型號(hào)： | KMM5362205C2WG |
| 廠商： | SAMSUNG SEMICONDUCTOR CO. LTD. |
| 英文描述： | 2M x 36 DRAM SIMM using 1Mx16 and 4M Quad CAS EDO, 1K Refresh |
| 中文描述： | 200萬(wàn)× 36的DRAM上海藥物研究所和4M使用1Mx16四中科院江戶，一千刷新 |
| 文件頁(yè)數(shù)： | 5/17頁(yè) |
| 文件大?。?/td> | 296K |
| 代理商： | KMM5362205C2WG |
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DRAM MODULE
KMM5362205C2W/C2WG
Rev. 0.0 (Nov. 1997)
- 5 -
I
CC1
, I
CC3
, I
CC4
and I
CC6
are dependent on output loading and cycle rates. Specified values are obtained with the output open.
I
CC
is specified as an average current. In I
CC1
and I
CC3
, address can be changed maximum once while RAS=V
IL
. In I
CC4
,
address can be changed maximum once within one EDO mode cycle,
t
HPC.
* NOTE
:
ABSOLUTE MAXIMUM RATINGS *
* Permanent device damage may occur if ABSOLUTE MAXIMUM RATINGS are exceeded. Functional operation should be restricted to
the conditions as detailed in the operational sections of this data sheet. Exposure to absolute maximum rating conditions for in
periods may affect device reliability.
tended
Item
Symbol
V
IN
, V
OUT
V
CC
T
stg
P
d
I
OS
Rating
-1 to +7.0
-1 to +7.0
-55 to +150
6
50
Unit
V
V
°
C
W
mA
Voltage on any pin relative to V
SS
Voltage on V
CC
supply relative to V
SS
Storage Temperature
Power Dissipation
Short Circuit Output Current
RECOMMENDED OPERATING CONDITIONS
(Voltage referenced to V
SS
, T
A
= 0 to 70
°
C)
*1 : V
CC
+2.0V/20ns, Pulse width is measured at V
CC
.
*2 : -2.0V/20ns, Pulse width is measured at V
SS
.
Item
Symbol
Min
4.5
0
2.4
-1.0
*2
Typ
Max
5.5
0
Vcc+1
*1
0.8
Unit
Supply Voltage
Ground
Input High Voltage
Input Low Voltage
V
CC
V
SS
V
IH
V
IL
5.0
0
-
-
V
V
V
V
DC AND OPERATING CHARACTERISTICS
(Recommended operating conditions unless otherwise noted)
I
CC1
I
CC2
I
CC3
I
CC4
I
CC5
I
CC6
I
I(L)
I
O(L)
V
OH
V
OL
Symbol
Speed
KMM5322205C2W/C2WG
Unit
Min
Max
391
361
12
391
361
331
301
6
391
361
30
10
-
0.4
I
CC1
-5
-6
-
-
mA
mA
mA
mA
mA
mA
mA
mA
mA
mA
uA
uA
V
V
I
CC2
I
CC3
Don
′
t care
-5
-6
-5
-6
Don
′
t care
-5
-6
-
-
-
-
-
-
-
-
I
CC4
I
CC5
I
CC6
I
I(L)
I
O(L)
V
OH
V
OL
Don
′
t care
-30
-10
2.4
-
Don
′
t care
: Operating Current * ( RAS, CAS, Address cycling @
t
RC
=min)
: Standby Current ( RAS=CAS=W=V
IH
)
: RAS Only Refresh Current * ( CAS=V
IH
, RAS cycling @
t
RC
=min)
: EDO Mode Current * ( RAS=V
IL
, CAS cycling :
t
HPC
=min)
: Standby Current ( RAS=CAS=W=Vcc-0.2V)
: CAS-Before-RAS Refresh Current * ( RAS and CAS cycling @
t
RC
=min)
: Input Leakage Current (Any input 0
≤
V
IN
≤
Vcc+0.5V, all other pins not under test=0 V)
: Output Leakage Current(Data Out is disabled, 0V
≤
V
OUT
≤
Vcc)
: Output High Voltage Level (I
OH
= -5mA)
: Output Low Voltage Level (I
OL
= 4.2mA)
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相關(guān)代理商/技術(shù)參數(shù) |
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| KMM53632000BK | 制造商:SAMSUNG 制造商全稱:Samsung semiconductor 功能描述:32M x 36 DRAM SIMM Using 16Mx4 & 16Mx1, 4K Refresh, 5V |
| KMM53632000BKG | 制造商:SAMSUNG 制造商全稱:Samsung semiconductor 功能描述:32M x 36 DRAM SIMM Using 16Mx4 & 16Mx1, 4K Refresh, 5V |
| KMM53632000CK | 制造商:SAMSUNG 制造商全稱:Samsung semiconductor 功能描述:32M x 36 DRAM SIMM Using 16Mx4 & 16Mx1, 4K Refresh, 5V |
| KMM53632000CKG | 制造商:SAMSUNG 制造商全稱:Samsung semiconductor 功能描述:32M x 36 DRAM SIMM Using 16Mx4 & 16Mx1, 4K Refresh, 5V |
| KMM53632004BK | 制造商:SAMSUNG 制造商全稱:Samsung semiconductor 功能描述:32M x 36 DRAM SIMM Using 16Mx4 & 16Mx1 4K Refresh, 5V |
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