參數(shù)資料
型號(hào): KMM5362205C2WG
廠商: SAMSUNG SEMICONDUCTOR CO. LTD.
英文描述: 2M x 36 DRAM SIMM using 1Mx16 and 4M Quad CAS EDO, 1K Refresh
中文描述: 200萬× 36的DRAM上海藥物研究所和4M使用1Mx16四中科院江戶,一千刷新
文件頁數(shù): 17/17頁
文件大小: 296K
代理商: KMM5362205C2WG
DRAM MODULE
KMM5362205C2W/C2WG
Rev. 0.0 (Nov. 1997)
- 17 -
PACKAGE DIMENSIONS
.133(3.38)
4.250(107.95)
3.984(101.19)
.125(3.17)
MIN
R.062
±
.004(R1.57
±
.10)
.250(6.35)
3.750(95.25)
.250(6.35)
Units : Inches (millimeters)
Gold & Solder Plating Lead
.010(.25)MAX
.050(1.27)
.041
±
.004(1.04
±
.10)
.100(2.54)
MIN
.350(8.89)
MAX
.054(1.37)
.047(1.19)
Tolerances :
±
.005(.13) unless otherwise specified
NOTE : The used device are 1Mx16 EDO DRAM and 1Mx4 Quad CAS with EDO DRAM.
DRAM Part No. : KMM5362205C2W/C2WG -- KM416C1204CJ (400 mil)
.750(19.05)
.400(10.16)
.125 DIA
±
.002(3.18
±
.051)
R.062(1.57)
.250(6.35)
.080(2.03)
( Back view )
( Front view )
-- KM44C1005DJ (300 mil)
Revision History
Rev 0.0 : Nov. 1997
.225(5.71)
MIN
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