Pad
No.
Pad Name I/O
Mask Option
Description
28
29
OSC1/PG1
OSC2/PG2
I
O
Pull-high*
Crystal
or RC
or Int. RC+I/O
or Int.
RC+RTC
OSC1, OSC2 are connected to an RC network or Crys-
tal (determined by mask option) for the internal sys-
tem clock. In the case of RC operation, OSC2 is the
output terminal for 1/4 system clock. These two pins
can also be optioned as an RTC oscillator (32768Hz) or
I/O lines. In these two cases, the system clock comes
from an internal RC oscillator whose frequency has 4
options (3.2MHz, 1.6MHz, 800kHz, 400kHz). If the I/O
option is selected, the pull-high options can also be en-
abled or disabled. Otherwise the PG1 and PG2 are
used as internal registers (pull-high resistors are al-
ways disabled).
Note: * The pull-high resistors of each I/O port (PA, PB, PC, PD, PG) are controlled by options.
Absolute Maximum Ratings
Supply Voltage ...............V
SS
0.3V to V
SS
+5.5V
Storage Temperature................. 50 C to 125 C
Input Voltage.................V
SS
0.3V to V
DD
+0.3V
Operating Temperature .............. 40 C to 85 C
Note: These are stress ratings only. Stresses exceeding the range specified under "Absolute Maxi-
mum Ratings" may cause substantial damage to the device. Functional operation of this device
at other conditions beyond those listed in the specification is not implied and prolonged expo-
sure to extreme conditions may affect device reliability.
D.C. Characteristics
Ta=25 C
Symbol
Parameter
Test Conditions
Min.
Typ.
Max.
Unit
V
DD
Conditions
V
DD1
Operating Voltage
f
SYS
=4MHz
2.4
5.5
V
V
DD2
Operating Voltage
f
SYS
=8MHz
4.5
5.5
V
I
DD1
Operating Current
(Crystal OSC)
3V
No load, f
SYS
=4MHz
1
2
mA
5V
3
5
mA
I
DD2
Operating Current
(RC OSC)
3V
No load, f
SYS
=4MHz
1
2
mA
5V
3
5
mA
I
DD3
Operating Current
(Crystal OSC)
5V
No load, f
SYS
=8MHz
4
8
mA
I
STB1
Standby Current
(WDT Enabled RTC Off)
3V
Noload,systemHALT
5
A
5V
10
A
I
STB2
Standby Current
(WDT Disabled RTC Off)
3V
Noload,systemHALT
1
A
5V
2
A
HT48C50-1
5
June 14, 2000
Preliminary