Pin Description
Pin No.
Pin Name
I/O
ROM Code
Option
Description
4~2
1
18
17
16, 15
PA0~PA2
PA3/PFD
PA4/TMR
PA5/INT
PA6, PA7
I/O
Pull-high
Wake-up
PA3 or PFD
Bidirectional 8-bit input/output port. Each bit can be
configured as wake-up input by ROM code option.
Software instructions determine the CMOS output or
Schmitt trigger input with or without pull-high resistor
(determined by pull-high options: bit option). The PFD,
TMR and INT are pin-shared with PA3, PA4 and PA5,
respectively.
8
7
6
5
PB0/AN0
PB1/AN1
PB2/AN2
PB3/AN3
I/O
Pull-high
Bidirectional 4-bit input/output port. Software in-
structions determine the CMOS output, Schmitt trig-
ger input with or without pull-high resistor
(determined by pull-high options: bit option) or A/D in-
put.
Once a PB line is selected as an A/D input (by using
software control), the I/O function and pull-high
resistor are disabled automatically.
9
VSS
Negative power supply, ground.
10
PD0/PWM
I/O
Pull-high
PD0 or
PWM
Bidirectional I/O line. Software instructions deter-
mine the CMOS output, Schmitt trigger input with or
without a pull-high resistor (determined by pull-high
options: bit option). The PWM output function is
pin-shared with PD0 (dependent on PWM options).
11
RES
I
Schmitt trigger reset input. Active low.
12
VDD
Positive power supply
13
14
OSC1
OSC2
I
O
Crystal
or RC
OSC1, OSC2 are connected to an RC network or a
Crystal (determined by ROM code option) for the in-
ternal system clock. In the case of RC operation, OSC2
is the output terminal for 1/4 system clock.
Absolute Maximum Ratings
Supply Voltage...............V
SS
0.3V to V
SS
+5.5V
Storage Temperature ................ 50 C to 125 C
Input Voltage.................V
SS
0.3V to V
DD
+0.3V
Operating Temperature.............. 40 C to 85 C
Note: These are stress ratings only. Stresses exceeding the range specified under Absolute Maxi-
mumRatings maycausesubstantialdamagetothedevice.Functionaloperationofthisdevice
at other conditions beyond those listed in the specification is not implied and prolonged expo-
sure to extreme conditions may affect device reliability.
HT46R47
Rev. 1.40
3
July 18, 2001