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參數(shù)資料
| 型號(hào)： | HSC-INTERFACEBOARD |
| 廠商： | Analog Devices, Inc. |
| 英文描述： | 1.75 MSPS, 4 mW 10-Bit/12-Bit Parallel ADCs |
| 中文描述： | 1.75 MSPS的，4 10-Bit/12-Bit并行模數(shù)轉(zhuǎn)換器毫瓦 |
| 文件頁數(shù)： | 5/16頁 |
| 文件大?。?/td> | 197K |
| 代理商： | HSC-INTERFACEBOARD |
REV. A
AD7470/AD7472
–
5
–
CAUTION
ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily
accumulate on the human body and test equipment and can discharge without detection.
Although the AD7470/AD7472 features proprietary ESD protection circuitry, permanent dam-
age may occur on devices subjected to high energy electrostatic discharges. Therefore, proper
ESD precautions are recommended to avoid performance degradation or loss of functionality.
WARNING!
ESD SENSITIVE DEVICE
ABSOLUTE MAXIMUM RATINGS
1
(T
A
= +25
°
C unless otherwise noted)
AV
DD
to AGND/DGND . . . . . . . . . . . . . . . . . –0.3 V to +7 V
DV
DD
to AGND/DGND . . . . . . . . . . . . . . . . . –0.3 V to +7 V
V
DRIVE
to AGND/DGND . . . . . . . . . . . . . . . . –0.3 V to +7 V
AV
DD
to DV
DD
. . . . . . . . . . . . . . . . . . . . . . .–0.3 V to +0.3 V
V
DRIVE
to DV
DD
. . . . . . . . . . . . . . . –0.3 V to DVDD + 0.3 V
AGND TO DGND . . . . . . . . . . . . . . . . . . . .–0.3 V to +0.3 V
Analog Input Voltage to AGND . . . –0.3 V to AVDD + 0.3 V
Digital Input Voltage to DGND . . . –0.3 V to DVDD + 0.3 V
REF IN to AGND . . . . . . . . . . . . . . –0.3 V to AVDD + 0.3 V
Input Current to Any Pin Except Supplies
2
. . . . . . . .
±
10 mA
Operating Temperature Range
Commercial (A and B Version) . . . . . . . . . –40
°
C to +85
°
C
Storage Temperature Range . . . . . . . . . . . –65
°
C to +150
°
C
Junction Temperature . . . . . . . . . . . . . . . . . . . . . . . . .+150
°
C
SOIC, TSSOP Package Dissipation . . . . . . . . . . . . . +450 mW
θ
JA
Thermal Impedance . . . . . . . . . . . . . . . 75
°
C/W (SOIC)
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .115
°
C/W (TSSOP)
θ
JC
Thermal Impedance . . . . . . . . . . . . . . . 25
°
C/W (SOIC)
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .35
°
C/W (TSSOP)
Lead Temperature, Soldering
Vapor Phase (60 secs) . . . . . . . . . . . . . . . . . . . . . . .+215
°
C
Infrared (15 secs) . . . . . . . . . . . . . . . . . . . . . . . . . . .+220
°
C
NOTES
1
Stresses above those listed under Absolute Maximum Ratings may cause perma-
nent damage to the device. This is a stress rating only; functional operation of the
device at these or any other conditions above those listed in the operational
sections of this specification is not implied. Exposure to absolute maximum rating
conditions for extended periods may affect device reliability.
2
Transient currents of up to 100 mA will not cause SCR latch-up.
ORDERING GUIDE
Temperature
Range
–40
°
C to +85
°
C
–40
°
C to +85
°
C
–40
°
C to +85
°
C
–40
°
C to +85
°
C
–40
°
C to +85
°
C
Resolution
(Bits)
Package
Options
1
Model
AD7470ARU
AD7472AR
AD7472BR
AD7472ARU
AD7472BRU
EVAL-AD7470CB
2
EVAL-AD7472CB
2
EVAL-CONTROL BOARD
3
HSC-INTERFACE BOARD
10
12
12
12
12
RU-24
R-24
R-24
RU-24
RU-24
Evaluation Board
Evaluation Board
Controller Board
Evaluation High Speed Interface Board
NOTES
1
R = SOIC; RU = TSSOP.
2
This can be used as a stand-alone evaluation board or in conjunction with the EVAL-CONTROL BOARD for evaluation/demonstration purposes.
3
This board is a complete unit allowing a PC to control and communicate with all Analog Devices evaluation boards ending in the CB designators.
PIN CONFIGURATIONS
TOP VIEW
(Not to Scale)
24
23
22
21
20
19
18
17
16
15
14
13
1
2
3
4
5
6
7
8
9
10
11
12
AD7470
NC = NO CONNECT
DB7
DB6
DB8
DB5
(MSB) DB9
DB4
AV
DD
REF IN
V
DRIVE
DV
DD
DGND
V
IN
AGND
DB3
CS
DB2
RD
DB1
CONVST
DB0 (LSB)
CLKIN
NC
BUSY
NC
TOP VIEW
(Not to Scale)
24
23
22
21
20
19
18
17
16
15
14
13
1
2
3
4
5
6
7
8
9
10
11
12
AD7472
DB9
DB8
DB10
DB7
(MSB) DB11
DB6
AV
DD
REF IN
V
DRIVE
DV
DD
DGND
V
IN
AGND
DB5
CS
DB4
RD
DB3
CONVST
DB2
CLKIN
DB1
BUSY
DB0 (LSB)
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