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參數資料
| 型號： | HS-6617RH |
| 廠商： | Intersil Corporation |
| 英文描述： | Radiation Hardened 2K x 8 CMOS PROM |
| 中文描述： | 輻射加固2K × 8的CMOS胎膜早破 |
| 文件頁數： | 6/14頁 |
| 文件大?。?/td> | 128K |
| 代理商： | HS-6617RH |
6
HS-6617RH
Spec Number
518742
Intersil Space Level Product Flow -Q
Wafer Lot Acceptance (All Lots) Method 5007
(Includes SEM)
GAMMA Radiation Verification (Each Wafer) Method 1019,
2 Samples/Wafer, 0 Rejects
100% Die Attach (Note 1)
100% Nondestructive Bond Pull, Method 2023
Sample - Wire Bond Pull Monitor, Method 2011
Sample - Die Shear Monitor, Method 2019 or 2027
100% Internal Visual Inspection, Method 2010, Condition A
CSI and/or GSI Pre-Cap (Note 8)
100% Temperature Cycle, Method 1010, Condition C,
10 Cycles
100% Constant Acceleration, Method 2001, Condition per
Method 5004
100% PIND, Method 2020, Condition A
100% External Visual
100% Serialization
100% Initial Electrical Test (T0)
100% Static Burn-In 1, Condition A or B, 72 Hours Min,
+125
o
C Min, Method 1015
100% Interim Electrical Test 1 (T1)
100% Delta Calculation (T0-T1)
100% PDA 1, Method 5004 (Note 2)
100% Dynamic Burn-In, Condition D, 240 Hours, +125
o
C or
Equivalent, Method 1015
100% Interim Electrical Test 2(T2)
100% Delta Calculation (T0-T2)
100% PDA 2, Method 5004 (Note 2)
100% Final Electrical Test
100% Fine/Gross Leak, Method 1014
100% Radiographic (X-Ray), Method 2012 (Note 3)
100% External Visual, Method 2009
Sample - Group A, Method 5005 (Note 4)
Sample - Group B, Method 5005 (Notes 5 and 6)
Sample - Group D, Method 5005 (Notes 6 and 7)
100% Data Package Generation (Note 9)
CSI and/or GSI Final (Note 8)
NOTES:
1. Epoxy or Silver glass die attach shall be permitted.
2. Failures from subgroup 1, 7 and deltas are used for calculating PDA. The maximum allowable PDA = 5% with no more than 3% of the
failures from subgroup 7.
3. Radiographic (X-Ray) inspection may be performed at any point after serialization as allowed by Method 5004.
4. Alternate Group A testing may be performed as allowed by MIL-STD-883, Method 5005.
5. QCI Subgroup B5 samples are programmed with a checkerboard pattern before life test and pattern tested after life test. Therefore, the
Subgroup B5 samples must be considered destruct samples and cannot be shipped as flight quantity.
6. Group B and D inspections are optional and will not be performed unless required by the P.O. When required, the P.O. should include
separate line items for Group B Test, Group Samples, Group D Test and Group D Samples.
7. Group D Generic Data, as defined by MIL-I-38535, is optional and will not be supplied unless required by the P.O. When required, the
P.O. should include a separate line item for Group D Generic Data. Generic data is not guaranteed to be available and is therefore not
available in all cases.
8. CSI and/or GSI inspections are optional and will not be performed unless required by the P.O. When required, the P.O. should include
separate line items for CSI PreCap inspection, CSI Final Inspection, GSI PreCap inspection, and/or GSI Final Inspection.
9. Data Package Contents:
Cover Sheet (Intersil Name and/or Logo, P.O. Number, Customer Part Number, Lot Date Code, Intersil Part Number, Lot Number, Quan-
tity).
Wafer Lot Acceptance Report (Method 5007). Includes reproductions of SEM photos with percent of step coverage.
GAMMA Radiation Report. Contains Cover page, disposition, Rad Dose, Lot Number, Test Package used, Specification Numbers, Test
equipment, etc. Radiation Read and Record data on file at Intersil.
X-Ray report and film. Includes penetrometer measurements.
Screening, Electrical, and Group A attributes (Screening attributes begin after package seal).
Lot Serial Number Sheet (Good units serial number and lot number).
Variables Data (All Delta operations). Data is identified by serial number. Data header includes lot number and date of test.
Group B and D attributes and/or Generic data is included when required by the P.O.
The Certificate of Conformance is a part of the shipping invoice and is not part of the Data Book. The Certificate of Conformance is signed
by an authorized Quality Representative.
相關PDF資料 |
PDF描述 |
|---|---|
| HS-6664RH | Radiation Hardened 8K x 8 CMOS PROM |
| HS-801 | ECL |
| HS-807 | ECL |
| HS-809 | ECL |
| HS-80A | ECL |
相關代理商/技術參數 |
參數描述 |
|---|---|
| HS-6617RH_00 | 制造商:INTERSIL 制造商全稱:Intersil Corporation 功能描述:Radiation Hardened 2K x 8 CMOS PROM |
| HS-6617RH-T | 制造商:INTERSIL 制造商全稱:Intersil Corporation 功能描述:Radiation Hardened 2K x 8 CMOS PROM |
| HS662 | 制造商:未知廠家 制造商全稱:未知廠家 功能描述:Peripheral IC |
| HS663 | 制造商:未知廠家 制造商全稱:未知廠家 功能描述:Peripheral IC |
| HS664 | 制造商:未知廠家 制造商全稱:未知廠家 功能描述:Peripheral IC |
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