1
CAUTION: These devices are sensitive to electrostatic discharge; follow proper IC Handling Procedures.
http://www.intersil.com or 407-727-9207
|
Copyright
Intersil Corporation 1999
HS-6617RH
Radiation Hardened
2K x 8 CMOS PROM
Pinouts
24 LEAD CERAMIC DUAL-IN-LINE
METAL SEAL PACKAGE (SBDIP)
MIL-STD-1835 CDIP2-T24
TOP VIEW
24 LEAD CERAMIC METAL SEAL FLATPACK
PACKAGE (FLATPACK)
MIL-STD-1835 CDFP4-F24
TOP VIEW
PIN
DESCRIPTION
A
Address Input
Q
Data Output
E
Chip Enable
G
Output Enable
P
Program Enable (P Hardwired to
VDD, except during programming)
1
2
3
4
5
6
7
8
9
10
11
12
A7
A6
A5
A4
A3
A2
A1
A0
Q0
Q1
Q2
GND
16
17
18
19
20
21
22
23
24
15
14
13
VDD
A9
P
G
A10
Q7
Q5
Q4
Q3
A8
E
Q6
A7
A6
A5
A4
A3
A2
A1
A0
Q0
Q1
Q2
GND
VDD
A8
A9
P
G
A10
E
Q7
Q6
Q5
Q4
Q3
2
3
4
5
6
7
8
9
10
11
12
1
24
23
22
21
20
19
18
17
16
15
14
13
Features
Total Dose 1 x 10
5
RAD (Si)
Latch-Up Free >1 x 10
12
RAD (Si)/s
Field Programmable
Functionally Equivalent to HM-6617
Pin Compatible with Intel 2716
Low Standby Power 1.1mW Max
Low Operating Power 137.5mW/MHz Max
Fast Access Time 100ns Max
TTL Compatible Inputs/Outputs
Synchronous Operation
On Chip Address Latches
Three-State Outputs
Nicrome Fuse Links
Easy Microprocessor Interfacing
Military Temperature Range -55
o
C to +125
o
C
Description
The Intersil HS-6617RH is a radiation hardened 16K CMOS PROM,
organized in a 2K word by 8-bit format. The chip is manufactured
using a radiation hardened CMOS process, and is designed to be
functionally equivalent to the HM-6617. Synchronous circuit design
techniques combine with CMOS processing to give this device high
speed performance with very low power dissipation.
On chip address latches are provided, allowing easy interfacing with
recent generation microprocessors that use multiplexed address/data
bus structure, such as the HS-80C85RH or HS-80C86RH. The output
enable control (G) simplifies microprocessor system interfacing by
allowing output data bus control, in addition to, the chip enable
control. Synchronous operation of the HS-6617RH is ideal for high
speed pipe-lined architecture systems and also in synchronous logic
replacement functions.
Applications for the HS-6617RH CMOS PROM include low power
microprocessor based instrumentation and communications systems,
remote data acquisition and processing systems, processor control
store, and synchronous logic replacement.
Ordering Information
PART NUMBER
TEMPERATURE RANGE
-55
o
C to +125
o
C
-55
o
C to +125
o
C
25
o
C
-55
o
C to +125
o
C
-55
o
C to +125
o
C
-55
o
C to +125
o
C
25
o
C
-55
o
C to +125
o
C
PACKAGE
HS1-6617RH-Q
24 Lead SBDIP
HS1-6617RH-8
24 Lead SBDIP
HS1-6617RH/SAMPLE
24 Lead SBDIP
HS1-6617RH/PROTO
24 Lead SBDIP
HS9-6617RH-Q
24 Lead Flatpack
HS9-6617RH-8
24 Lead Flatpack
HS9-6617RH/Sample
24 Lead Flatpack
HS9-6617RH/PROTO
24 Lead Flatpack
August 1995
Spec Number
518742
File Number
3033.3
D