參數(shù)資料
型號(hào)： HFA3860BIV96
廠商： HARRIS SEMICONDUCTOR
元件分類： 無繩電話/電話
英文描述： nullDirect Sequence Spread Spectrum Baseband Processor
中文描述： TELECOM, CELLULAR, BASEBAND CIRCUIT, PQFP48
文件頁(yè)數(shù)： 40/40頁(yè)
文件大?。?/td> 272K
代理商： HFA3860BIV96
4-40
All Intersil semiconductor products are manufactured, assembled and tested under
ISO9000
quality systems certification.
Intersil semiconductor products are sold by description only. Intersil Corporation reserves the right to make changes in circuit design and/or specifications at any time with-
out notice. Accordingly, the reader is cautioned to verify that data sheets are current before placing orders. Information furnished by Intersil is believed to be accurate and
reliable. However, no responsibility is assumed by Intersil or its subsidiaries for its use; nor for any infringements of patents or other rights of third parties which may result
from its use. No license is granted by implication or otherwise under any patent or patent rights of Intersil or its subsidiaries.
For information regarding Intersil Corporation and its products, see web site
http://www.intersil.com
Sales Office Headquarters
NORTH AMERICA
Intersil Corporation
P. O. Box 883, Mail Stop 53-204
Melbourne, FL 32902
TEL: (407) 724-7000
FAX: (407) 724-7240
TEL: (32) 2.724.2111
FAX: (32) 2.724.22.05
EUROPE
Intersil SA
Mercure Center
100, Rue de la Fusee
1130 Brussels, Belgium
ASIA
Intersil (Taiwan) Ltd.
7F-6, No. 101 Fu Hsing North Road
Taipei, Taiwan
Republic of China
TEL: (886) 2 2716 9310
FAX: (886) 2 2715 3029
HFA3860B
Thin Plastic Quad Flatpack Packages (TQFP)
D
D1
E E1
-A-
PIN 1
A2 A1
A
11
o
-13
o
11
o
-13
o
0
o
-7
o
0.020
0
o
MIN
L
PLANE
b
0.004/0.008
0.09/0.20
WITH PLATING
BASE METAL
SEATING
0.004/0.006
0.09/0.16
b1
-B-
e
0.003
0.08
A-B
S
D
S
C
M
0.08
0.003
-C-
-D-
-H-
0.25
0.010
GAGE
PLANE
Q48.7x7
(JEDEC MS-026ABC ISSUE B)
48 LEAD THIN PLASTIC QUAD FLATPACK PACKAGE
SYMBOL
INCHES
MILLIMETERS
NOTES
MIN
MAX
MIN
MAX
A
-
0.047
-
1.20
-
A1
0.002
0.005
0.05
0.15
-
A2
0.038
0.041
0.95
1.05
-
b
0.007
0.010
0.17
0.27
6
b1
0.007
0.009
0.17
0.23
-
D
0.350
0.358
8.90
9.10
3
D1
0.272
0.280
6.90
7.10
4, 5
E
0.350
0.358
8.90
9.10
3
E1
0.272
0.280
6.90
7.10
4, 5
L
0.018
0.029
0.45
0.75
-
N
48
48
7
e
0.020 BSC
0.50 BSC
-
Rev. 1 9/98
NOTES:
1. Controlling dimension: MILLIMETER. Converted inch
dimensions are not necessarily exact.
2. All dimensions and tolerances per ANSI Y14.5M-1982.
3. Dimensions D and E to be determined at seating plane
4. Dimensions D1 and E1 to be determined at datum plane
.
5. Dimensions D1 and E1 do not include mold protrusion.
Allowable protrusion is 0.25mm (0.010 inch) per side.
6. Dimension b does not include dambar protrusion. Allowable
dambar protrusion shall not cause the lead width to exceed
the maximum b dimension by more than 0.08mm (0.003
inch).
7. “N” is the number of terminal positions.
.
-C-
-H-
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