參數(shù)資料
型號: HDMP-0422
英文描述: Single Port Bypass Circuit with CDR & Data Valid Detection Capability for Fibre Channel Arbitrated Loops
中文描述: 單端口旁路電路的CDR
文件頁數(shù): 12/14頁
文件大?。?/td> 235K
代理商: HDMP-0422
12
Package Information
Power Dissipation and Thermal Resistance.
V
CC
= 3.15 V to 3.45 V.
Symbol
Parameter
P
D
Power Dissipation
Θ
jc[1]
Thermal Resistance, Junction to Case
Units
mW
°
C/W
Typ.
460
14
Max.
Item
Package Material
Lead Finish Material
Lead Finish Thickness
Lead Skew
Lead Coplanarity (Seating Plane)
Details
Plastic Shrink Small Outline (SSOP) Per JESD Pub 95, MO-150, Var AG
85% Tin, 15% Lead
200-800 micro-inches
0.15 mm max
0.10 mm max
Mechanical Dimensions
Note:
1. Based on independent package testing by Agilent.
Θ
ja
for this device is 57oC/W.
Θ
ja
is measured on a standard 3x3” FR4 PCB in a still air
environment. To determine the actual junction temperature in a given application, use the following equation:
T
j
= T
C
+ (
Θ
ja
x P
D
), where T
C
is the case temperature measured on the top center of the package and P
D
is the power being dissipated.
E1
D
b
PIN #1 ID
E
A
A1
e
DIMENSION
A
A1
D
E
E1
e
b
HDMP-0422
2.13
8.20
7.80
5.30
0.65
0.22/
0.38
MIN./
MAX.
TOLERANCE
MAX.
±0.30 ±0.40
±0.30
BSC
ALL DIMENSIONS ARE IN MILLIMETERS
A2
0.25
GAGE
PLANE
c
TOP VIEW
2
3
4
5
6
7
8
9
10 11 12
1
23 22 21 20 19 18 17 16 15 14 13
24
L
+0.13/
–0.27
0.90
c
0.09/
0.20
MIN./
MAX.
A2
1.75
±0.13
0.05/
0.25
MIN./
MAX.
SEATING PLANE
L
Figure 11. HDMP-0422 package drawing.
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