參數(shù)資料
型號: FT245RL-REEL
廠商: FTDI, Future Technology Devices International Ltd
文件頁數(shù): 31/37頁
文件大?。?/td> 0K
描述: IC USB TO PARALLEL FIFO 28-SSOP
產(chǎn)品培訓(xùn)模塊: USB Introduction
標(biāo)準(zhǔn)包裝: 1
應(yīng)用: USB 至 FIFO 控制器
接口: USB,F(xiàn)IFO,(同步/異步)
電源電壓: 1.8 V ~ 5.25 V
封裝/外殼: 28-SSOP(0.209",5.30mm 寬)
供應(yīng)商設(shè)備封裝: 28-SSOP
包裝: 標(biāo)準(zhǔn)包裝
安裝類型: 表面貼裝
產(chǎn)品目錄頁面: 634 (CN2011-ZH PDF)
配用: 768-1020-ND - MOD USB PARALLEL FIFO DEV FT245R
其它名稱: 768-1011-6
Copyright 2010 Future Technology Devices International Limited
37
Document No.: FT_000052
FT245R USB FIFO IC Datasheet Version 2.12
Clearance No.: FTDI# 39
Appendix C - Revision History
Version 0.90
Initial Datasheet Created
August 2005
Version 0.94
Revised Pre-release datasheet
October 2005
Version 1.00
Full datasheet released
December 2005
Version 1.02
Minor revisions to datasheet released
December 2005
Version 1.03
Manufacturer ID added to default EEPROM data
January 2006
Version 1.04
Buffer sizes added
January 2006
Version 1.05
QFN-32 Package pad layout and solder paste diagrams added
January 2006
Version 2.00
Reformatted, added notes for 3.3V operation;
June 2008
Part numbers, TID, corrected; QFN Package drawing corrected.
Added FIFO characteristics for +1.8V; Added MTTF data
Corrected the input switching threshold and input hysteresis figures for VCCIO=+5V
Version 2.01
Corrected the RX and TX Buffer data flow direction in the block
Diagram Figure 2.1
July 2008
Version 2.02
Removed repeated section of table 8.1
Improved graphics on Figures 6.2, 6.3, 6.4 and 7.1
Add Packing details
Changed USB suspend current spec from 500uA to 2.5m
Corrected Figure 9.2 QFN dimensions.
August 2008
Version 2.03
Amended definition of FIFO TX and RX buffers to be consistent
Updated company contact information.
February 2009
Version 2.04
Corrected Tape and Reel quantities
Added LOT numbers to the device markings.
Clarified VCC operation and added section headed “Using an external Oscillator”
Added 3V3 regulator output tolerance
April 2009
Version 2.05
Corrected Tx and RX buffer sizes on front page
June 2009
Version 2.06
Additional dimensions added to QFN solder profile
June 2009
Version 2.07
Changed label D6 to 'D7' (pin 3) on FT245RQ schematic symbol
Updated to latest TID number
Added Window 7 support
October 2009
Version 2.08
Modified package dimensions to 5.0 x 5.0 +/-0.075mm.
December 2009
and Solder paste diagram to 2.50 x 2.50 +/-0.0375mm
Added FT_PROG utility references
Added Appendix A-references
Corrected USB-IF TID
Version 2.09
Updated section 6.2, Figure 6.2 and the note,
May 2010
Updated section 5.3, Table 5.13, EEPROM data retention time
Version 2.10
Removed RD# and WR# references on BitBang modes
July 2010
Corrected US Support email address. Added USB Compliance logo
Version 2.11 Updated USB-IF TID for Rev C
April 2011
Version 2.12 Corrected TID for Rev C
April 2011
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