參數資料
型號： FXLA2203UMX
廠商： Fairchild Semiconductor
文件頁數： 1/16頁
文件大?。?/td> 0K
描述： TRANSLATOR LEVEL DUAL 24UMLP
標準包裝： 5,000
應用： 用戶標識模塊（SIM）
電源電壓： 1.65 V ~ 3.6 V
封裝/外殼： 24-UMLP
供應商設備封裝： 24-UMLP
包裝： 帶卷 (TR)
安裝類型： 表面貼裝
August 2012
2010 Fairchild Semiconductor Corporation
www.fairchildsemi.com
FXLA2203 Rev. 1.0.5
FXLA2203
—
Dual-Mode,
Dual-SI
M-Card
Level
Translator
FXLA2203
Dual-Mode, Dual-SIM-Card Level Translator
Features
Easy-to-Use “Single Pin” SIM Card Swap Control
Channel Swap Time: 130ns (Typical)
Simultaneous Dual-Mode, Dual-SIM Communication
Host Ports: 1.65V to 3.6V Voltage Translation
Card Ports: 1.65V to 3.6V Voltage Translation
Leverages the Presence of Existing PMIC LDOs
ISO7816 Compliant
Power Switch RON: 0.5Ω (Typical)
Supports Class B 3V SIM / UIM Cards
Supports Class C: 1.8V SIM / UIM Cards
Non-Preferential Host VCC Power-Up Sequencing
Activation / Deactivation Timing Compliant
per ISO7816-03
Internal Pull up Resistors for Bi-Directional I/O Pin
Outputs Switch to 3-State if Host VCC at GND
Power-Off Protection
Packaged in 24-Terminal UMLP (2.5mm x 3.5mm)
Direction Control Not Needed
Applications
Dual-Mode Dual-SIM Applications
GSM, CDMA, WCDMA, TDSCDMA CDMA2000,
3G Cellular Phones
Mobile TV: OMA BCAST
Description
The
FXLA2203
allows
either
two
hosts
to
simultaneously communicate with two Subscriber
Identity Modules (SIM), or two User Identity Modules
(UIM). Dual Mode refers to the mobile phones that are
compatible
with more than one form of data
transmission or network (such as GSM, CDMA,
WCDMA, TDSCDMA, or CDMA2000), resulting in a
dual-baseband processor configuration. In a dual-mode
application, the FXLA2203 host ports interface directly
with the baseband processors (see Figure 9).
The bi-directional I/O open-drain channel features auto-
direction and internal 10K
Ω pull-up resistors. RST and CLK
provide unidirectional translation from host to card only.
Either host can swap SIM slots with the assertion of a
single control pin: CH_Swap. The typical channel swap
time is 130ns.
The FXLA2203 does not contain internal Low Dropout
Regulator (LDOs). Instead, the FXLA2203 architecture
incorporates two low-RON internal power switches for
routing existing PMIC (Power Management Integrated
Circuit) LDOs to individual SIM slots. This reduces
overall system power, leverages existing LDO system
resources, and aligns with the philosophy that
centralizing LDOs in the PMIC facilitates power
management. Since the FXLA2203 does not block the
LDO function to the SIM card, existing activation /
deactivation timing transparency is maintained between
Hosts, PMICs, and SIM cards.
The device allows voltage translation from as high as
3.6V to as low as 1.65V. Each port tracks its own port
power supply.
Ordering Information
Part Number
Operating
Temperature Range
Package
Packing
Method
FXLA2203UMX
-40 to 85°C
24-Terminal, 2.5mm x 3.4mm Ultrathin Molded
Leadless Package (UMLP), 0.4mm Pitch
Tape and Reel
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