參數(shù)資料
型號(hào)： FT245RL-REEL
廠商： FTDI, Future Technology Devices International Ltd
文件頁數(shù)： 26/37頁
文件大?。?/td> 0K
描述： IC USB TO PARALLEL FIFO 28-SSOP
產(chǎn)品培訓(xùn)模塊： USB Introduction
標(biāo)準(zhǔn)包裝： 1
應(yīng)用： USB 至 FIFO 控制器
接口： USB，F(xiàn)IFO，（同步/異步）
電源電壓： 1.8 V ~ 5.25 V
封裝/外殼： 28-SSOP（0.209"，5.30mm 寬）
供應(yīng)商設(shè)備封裝： 28-SSOP
包裝： 標(biāo)準(zhǔn)包裝
安裝類型： 表面貼裝
產(chǎn)品目錄頁面： 634 (CN2011-ZH PDF)
配用： 768-1020-ND - MOD USB PARALLEL FIFO DEV FT245R
其它名稱： 768-1011-6
Copyright 2010 Future Technology Devices International Limited
32
Document No.: FT_000052
FT245R USB FIFO IC Datasheet Version 2.12
Clearance No.: FTDI# 39
10.5 Solder Reflow Profile
The FT245R is supplied in Pb free 28 LD SSOP and QFN-32 packages. The recommended solder reflow
profile for both package options is shown in 0.
Figure 10.5 FT245R Solder Reflow Profile
The recommended values for the solder reflow profile are detailed in Table 10.1. Values are shown for
both a completely Pb free solder process (i.e. the FT245R is used with Pb free solder), and for a non-Pb
free solder process (i.e. the FT245R is used with non-Pb free solder).
Profile Feature
Pb Free Solder Process
Non-Pb Free Solder Process
Average Ramp Up Rate (Ts to Tp)
3°C / second Max.
3°C / Second Max.
Preheat
- Temperature Min (Ts Min.)
- Temperature Max (Ts Max.)
- Time (ts Min to ts Max)
150°C
200°C
60 to 120 seconds
100°C
150°C
60 to 120 seconds
Time Maintained Above Critical
Temperature TL:
- Temperature (TL)
- Time (tL)
217°C
60 to 150 seconds
183°C
60 to 150 seconds
Peak Temperature (Tp)
260°C
240°C
Time within 5°C of actual Peak
Temperature (tp)
20 to 40 seconds
Ramp Down Rate
6°C / second Max.
Time for T= 25°C to Peak Temperature,
Tp
8 minutes Max.
6 minutes Max.
Table 10.1 Reflow Profile Parameter Values
Critical Zone: when
T is in the range
T to T
T
e
m
p
e
ra
tu
re
,
T
(D
e
g
re
e
s
C
)
Time, t (seconds)
25
P
T = 25 C to T
tp
Tp
TL
t
Preheat
S
t
L
Ramp Up
L
p
Ramp
Down
T Max
S
T Min
S
相關(guān)PDF資料
PDF描述
FT4232HQ-REEL IC USB HS QUAD UART/SYNC 64-QFN
FUSB1500MHX IC USB 2.0 TRANSCEIVER 16-MLP
FUSB2805MLX TXRX USB2.0 HS OTG ULPI 32MLP
FXLA2203UMX TRANSLATOR LEVEL DUAL 24UMLP
GAL16V8D-15LJN SPLD 62.5MHZ EECMOS 20 PLCC
相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
FT245RL-TUBE 制造商:Future Technology Devices International (FTDI Chip) 功能描述:USB FIFO IC 28-Pin SSOP Tube
FT245RQ 制造商:Future Technology Devices International 功能描述:Single Chip USB 32-Pin QFN 制造商:Future Technology Devices International (FTDI Chip) 功能描述:IC USB TO FIFO SMD QFN-32 245 制造商:Future Technology Devices International (FTDI Chip) 功能描述:IC, USB TO FIFO, SMD, QFN-32, 245 制造商:Future Technology Devices International (FTDI Chip) 功能描述:USB Full Speed to Parallel FIFO IC, Includes Oscillator and EEPROM - QFN-32 制造商:Future Technology Devices International (FTDI Chip) 功能描述:IC, USB FIFO INTERFACE, QFN-32; USB Type:USB FIFO; USB Version:2.0; Supply Voltage Min:1.8V; Supply Voltage Max:5.25V; Digital IC Case Style:QFN; No. of Pins:32; Data Rate:1Mbps; No. of Ports:2; Operating Temperature Min:-40C ;RoHS Compliant: Yes
FT245RQ-6000 制造商:FTDI 制造商全稱:FTDI 功能描述:USB FIFO IC - Single chip USB to parallel FIFO bidirectional data transfer interface
FT245RQ-REEL 功能描述:USB 接口集成電路 USB to Parallel FIFO Enhanced IC QFN-32 RoHS:否 制造商:Cypress Semiconductor 產(chǎn)品:USB 2.0 數(shù)據(jù)速率: 接口類型:SPI 工作電源電壓:3.15 V to 3.45 V 工作電源電流: 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:WLCSP-20
FT245RQ-TRAY 制造商:Future Technology Devices International (FTDI Chip) 功能描述:Single Chip USB Tray
發(fā)布緊急采購(gòu)，3分鐘左右您將得到回復(fù)。

采購(gòu)需求

(若只采購(gòu)一條型號(hào)，填寫一行即可)

發(fā)布成功！您可以繼續(xù)發(fā)布采購(gòu)。也可以進(jìn)入我的后臺(tái)，查看報(bào)價(jià)

發(fā)布成功！您可以繼續(xù)發(fā)布采購(gòu)。也可以進(jìn)入我的后臺(tái)，查看報(bào)價(jià)

*型號(hào) *數(shù)量 廠商 批號(hào) 封裝
添加更多采購(gòu)

我的聯(lián)系方式

*
*
*