2003 Fairchild Semiconductor Corporation
May 2003
F
FFH1N30HS60DD RevA
FF1N30HS60DD
30A, 600V Stealth Diode
General Description
The FF1N30HS60DD is a Stealth diode optimized for low
loss performance in high frequency hard switched applications.
The Stealth family exhibits low reverse recovery current
(I
RM(REC)
) and exceptionally soft recovery under typical
operating conditions.
This device is intended for use as a free wheeling or boost
diode in power supplies and other power switching
applications. The low I
RM(REC)
and short t
a
phase reduce loss
in switching transistors. The soft recovery minimizes ringing,
expanding the range of conditions under which the diode may
be operated without the use of additional snubber circuitry.
Consider using the Stealth diode with an SMPS IGBT to
provide the most efficient and highest power density design at
lower cost.
Formerly developmental type TA49411
.
Features
Soft Recovery . . . . . . . . . . . . . . . . . . . . . . . .t
b
/ t
a
> 1.2
Fast Recovery . . . . . . . . . . . . . . . . . . . . . . . . . t
rr
< 35ns
Operating Temperature . . . . . . . . . . . . . . . . . . . . 175
o
C
Reverse Voltage. . . . . . . . . . . . . . . . . . . . . . . . . . . 600V
Fully Isolated Package (2,500 volt AC)
Extremely Low Switching Losses
Avalanche Energy Rated
Applications
Switch Mode Power Supplies
Hard Switched CCM PFC Boost Diode
UPS and Motor Drive Free Wheeling Diode
SMPS FWD
Snubber Diode
Device Maximum Ratings
(per diode)
T
C
= 25°C unless otherwise noted
Symbol
V
RRM
V
RWM
V
R
I
F(AV)
I
FRM
I
FSM
P
D
E
AVL
T
J
, T
STG
M
d
Parameter
Ratings
600
600
600
30
70
325
136
20
-55 to 175
1.5/13
1.5/13
Units
V
V
V
A
A
A
W
mJ
°C
Nm/lb.in.
Nm/lb.in.
Repetitive Peak Reverse Voltage
Working Peak Reverse Voltage
DC Blocking Voltage
Average Rectified Forward Current (T
C
= 110
o
C)
Repetitive Peak Surge Current (20kHz Square Wave)
Nonrepetitive Peak Surge Current (Halfwave 1 Phase 60Hz)
Power Dissipation
Avalanche Energy (1A, 40mH)
Operating and Storage Temperature Range
Mounting force
Terminal connection torque
Maximum Temperature for Soldering
Leads at 0.063in (1.6mm) from Case for 10s
Package Body for 10s, See Techbrief TB334
CAUTION: Stresses above those listed in “Device Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and
operation of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied.
T
L
T
PKG
300
260
°C
°C
K
A
JEDEC SOT-227
K
A
Package
Symbol