參數(shù)資料
型號: BX80525U733256E
廠商: INTEL CORP
元件分類: 微控制器/微處理器
英文描述: 32-BIT, 733 MHz, MICROPROCESSOR, XMA
文件頁數(shù): 64/102頁
文件大?。?/td> 878K
代理商: BX80525U733256E
64
Datasheet
Pentium III Processor for the SC242 at 450 MHz to 800 MHz
5.3
S.E.C.C.2 Structural Mechanical Specification
The intention of the structural specification for S.E.C.C.2 is to ensure that the package will not be
exposed to excessive stresses that could adversely affect device reliability. Figure 44 illustrates the
deflection specification for deflections away from the heatsink. Figure 45 illustrates the deflection
specification in the direction of the heatsink.
The heatsink attach solution must not induce permanent stress into the S.E.C.C.2 substrate with the
exception of a uniform load to maintain the heatsink to the processor thermal interface. Figure 46
and Table 31 define the pressure specification.
Figure 43. Intel Pentium III Processor Markings (S.E.C.C.2 Package)
Table 30. Description Table for Processor Markings (S.E.C.C.2 Packaged Processor)
Code Letter
Description
A
Logo
C
Trademark
D
Logo
F
Dynamic Mark Area – with 2-D matrix
iCOMP 2.0 index=YYY
SZNNN/XYZ ORDER CODE
XXXXXXXX-NNNN
2-D Matrix Mark
Dynamic Mark Area
Hologram
Location
pentium
II
P
R
O
C
E
S
O
R
A
B
C
S ee N o te
NOTE:
Please refer to the Pentium III
Processor Specification Update
for this information.
D
F
Pentium
!!!
Figure 44. Substrate Deflection Away From Heat Sink
F/2
5 cycles maximum
0.025
Processor Substrate
Keep Out Zone (Front Side View)
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