<small id="wwwo4"></small>
<dl id="wwwo4"><strike id="wwwo4"><big id="wwwo4"></big></strike></dl>
<nobr id="wwwo4"></nobr>
<small id="wwwo4"><menu id="wwwo4"></menu></small>
<code id="wwwo4"><dfn id="wwwo4"><li id="wwwo4"></li></dfn></code>
    • <table id="wwwo4"><optgroup id="wwwo4"><button id="wwwo4"></button></optgroup></table>
            


    
    



    

    
  
    
    
    
    
  
    
  
  

    





    


    
 
 




 
 


    

    
    


    參數(shù)資料
    

    


    


    
型號(hào)：
BX80525U733256E

    

    
廠商：
INTEL CORP

    

    
元件分類：
微控制器/微處理器

    

    
英文描述：
32-BIT, 733 MHz, MICROPROCESSOR, XMA

    

    
文件頁(yè)數(shù)：
48/102頁(yè)

    

    
文件大?。?/td>
878K

    

    
代理商：
BX80525U733256E


    

    

    

	
    
    
    

    
    
	
    Datasheet
    5
    Pentium III Processor for the SC242 at 450 MHz to 800 MHz
    Figures
    1
    Second Level (L2) Cache Implementation ........................................................... 7
    2
    AGTL+ Bus Topology .......................................................................................... 12
    3
    Stop Clock State Machine ................................................................................... 12
    4
    BSEL[1:0] Example for a 100 MHz System Design
    (100 MHz Processor Installed) ............................................................................20
    5
    BSEL[1:0] Example for a 100/133 MHz Capable System
    (100 MHz Processor Installed) ............................................................................21
    6
    BSEL[1:0] Example for a 100/133 MHz Capable System
    (133 MHz Processor Installed) ............................................................................21
    7
    BCLK, PICCLK, and TCK Generic Clock Waveform ........................................... 33
    8
    System Bus Valid Delay Timings ........................................................................ 33
    9
    System Bus Setup and Hold Timings.................................................................. 34
    10
    System Bus Reset and Configuration Timings.................................................... 34
    11
    Power-On Reset and Configuration Timings....................................................... 34
    12
    Test Timings (TAP Connection) .......................................................................... 35
    13
    Test Reset Timings ............................................................................................. 35
    14
    BCLK and PICCLK Generic Clock Waveform ..................................................... 36
    15
    Maximum Acceptable AGTL+ and Non-AGTL+ Overshoot/Undershoot
    Waveform ............................................................................................................42
    16
    Low to High AGTL+ and Non-AGTL+ Receiver Ringback Tolerance ................. 44
    17
    Signal Overshoot/Undershoot, Settling Limit, and Ringback 1............................ 44
    18
    S.E.C.Cartridge — 3-Dimensional View.............................................................. 45
    19
    S.E.C.Cartridge 2 — Substrate View .................................................................. 46
    20
    Processor Functional Die Layout (CPUID 068xh) ............................................... 47
    21
    S.E.C.C. Packaged Processor — Multiple Views................................................ 49
    22
    S.E.C.C. Packaged Processor — Extended Thermal Plate Side Dimensions .... 50
    23
    S.E.C.C. Packaged Processor — Bottom View Dimensions...............................50
    24
    S.E.C.C. Packaged Processor — Latch Arm, Extended Thermal Plate Lug,
    and Cover Lug Dimensions ................................................................................. 51
    25
    S.E.C.C. Packaged Processor — Latch Arm, Extended Thermal Plate,
    and Cover Detail Dimensions (Reference Dimensions Only).............................. 52
    26
    S.E.C.C. Packaged Processor — Extended Thermal Plate Attachment
    Detail Dimensions ...............................................................................................53
    27
    S.E.C.C. Packaged Processor — Extended Thermal Plate Attachment
    Detail Dimensions, Continued ............................................................................. 54
    28
    S.E.C.C. Packaged Processor Substrate — Edge Finger Contact
    Dimensions.......................................................................................................... 54
    29
    S.E.C.C. Packaged Processor Substrate — Edge Finger Contact
    Dimensions, Detail A ........................................................................................... 55
    30
    Intel Pentium III Processor Markings (S.E.C.C. Packaged Processor) ...........55
    31
    S.E.C.C.2 Packaged Processor — Multiple Views.............................................. 56
    32
    S.E.C.C.2 Packaged Processor Assembly — Primary View ...............................57
    33
    S.E.C.C.2 Packaged Processor Assembly — Cover View with Dimensions ...... 57
    34
    S.E.C.C.2 Packaged Processor Assembly — Heat Sink Attach Boss Section ... 58
    35
    S.E.C.C.2 Packaged Processor Assembly — Side View .................................... 58
    36
    Detail View of Cover in the Vicinity of the Substrate Attach Features................. 58
    37
    S.E.C.C.2 Packaged Processor Substrate — Edge Finger Contact
    Dimensions.......................................................................................................... 59
    38
    S.E.C.C.2 Packaged Processor Substrate — Edge Finger Contact
    Dimensions (Detail A).......................................................................................... 59
    
    
    
    
    
    


    


    

    相關(guān)PDF資料
    		

    PDF描述
    		

    
    

    
BX80525U667256E
32-BIT, 667 MHz, MICROPROCESSOR, XMA

    

    
BX80532PC2500D
32-BIT, 2500 MHz, MICROPROCESSOR, XMA

    

    
BX80532PG3200D
32-BIT, 3200 MHz, MICROPROCESSOR, XGA478

    

    
BXA10-48S3V3-S
1-OUTPUT 8 W DC-DC REG PWR SUPPLY MODULE

    

    
BXA15-24S15
1-OUTPUT 15 W DC-DC REG PWR SUPPLY MODULE

    

    

    

    


    


    

    相關(guān)代理商/技術(shù)參數(shù)
    		

    參數(shù)描述
    		

    
    

    
BX80525U750256
 制造商:未知廠家 制造商全稱:未知廠家 功能描述:Microprocessor

    

    
BX80525U800256
 制造商:未知廠家 制造商全稱:未知廠家 功能描述:Microprocessor

    

    
BX80525U800256EB
 制造商:未知廠家 制造商全稱:未知廠家 功能描述:Microprocessor

    

    
BX80525U850256
 制造商:未知廠家 制造商全稱:未知廠家 功能描述:Microprocessor

    

    
BX80525U866256
 制造商:未知廠家 制造商全稱:未知廠家 功能描述:Microprocessor

    

    
    
    
    
	
    	
    
    
     
     
    發(fā)布緊急采購(gòu)，3分鐘左右您將得到回復(fù)。
    
 
     
    

   	  
    
     

    
                    			    				      
    
                
    
                  
    
                    
                    
    
                      
    
                      
                      
    采購(gòu)需求
      (若只采購(gòu)一條型號(hào)，填寫(xiě)一行即可)
    
                      
                      
    發(fā)布成功！您可以繼續(xù)發(fā)布采購(gòu)。也可以進(jìn)入我的后臺(tái)，查看報(bào)價(jià)
    
                      
                      
    發(fā)布成功！您可以繼續(xù)發(fā)布采購(gòu)。也可以進(jìn)入我的后臺(tái)，查看報(bào)價(jià)
    
                       
                        
    
                                
                                
    
                                    *型號(hào)
                                    *數(shù)量
                                    廠商
                                    批號(hào)
                                    封裝
                                  
    
                                    
                                
                                
    
                                    
                                        
    
                                            
                                            
                                        
    
                                        		
                                     
                                    
                                        
    
                                        		
                                    
                                        
    
                                        		
                                    
                                        
    
                                        		
                                    
                                        
    
                                        		
                                  
    
                                  
                                   
                                    
                            
    
                             
                             
							                            
    
                          添加更多采購(gòu)
    
                      
    
                      
                      
    
                      
                      
    我的聯(lián)系方式
    
                     
                     
                       
    
                                
                                
                                
    
                                    
                                         *
                                    
                                    
                                  
    
                                  
                                  
    
                                    
                                         *
                                    
                                    
                                  
    
                                  
                                  
    
                                    
                                        
                                    
                                    
                                  
    
                                  
                                  
    
                                    
                                         *