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參數(shù)資料
| 型號： | BGY241 |
| 廠商： | NXP SEMICONDUCTORS |
| 元件分類： | 衰減器 |
| 英文描述： | UHF amplifier module |
| 中文描述： | 880 MHz - 915 MHz RF/MICROWAVE NARROW BAND HIGH POWER AMPLIFIER |
| 封裝： | LEADLESS, PLASTIC, SOT482C, 5 |
| 文件頁數(shù)： | 7/12頁 |
| 文件大?。?/td> | 89K |
| 代理商： | BGY241 |
1999 Sep 09
7
Philips Semiconductors
Product specification
UHF amplifier module
BGY241
SOLDERING
The indicated temperatures are those at the solder
interfaces.
Advised solder types are types with a liquidus less than or
equal to 210
°
C.
Solder dots or solder prints must be large enough to wet
the contact areas.
Soldering can be carried out using a conveyor oven, a hot
air oven, an infrared oven or a combination of these
ovens. A double reflow process is permitted.
Hand soldering is not recommended because the
soldering iron tip can exceed the maximum permitted
temperature of 250
°
C and damage the module.
In case hand soldering is needed, recommendations can
be found in RNR-45-98-A-0485.
The maximum allowed temperature is 250
°
C for a
maximum of 5 seconds.
The maximum ramp-up is 10
°
C per second.
The maximum cool-down is 5
°
C per second.
Cleaning
The following fluids may be used for cleaning:
Alcohol
Bio-Act (Terpene Hydrocarbon)
Acetone.
Ultrasonic cleaning should not be used since this can
cause serious damage to the product.
handbook, halfpage
0
200
100
0
1
5
2
3
4
MGM159
t (min)
T
(
°
C)
Fig.11 Recommended reflow temperature profile.
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