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參數(shù)資料
| 型號： | BD9007HFP |
| 元件分類： | 穩(wěn)壓器 |
| 英文描述： | 2 A SWITCHING REGULATOR, 505 kHz SWITCHING FREQ-MAX, PSSO7 |
| 封裝： | ROHS COMPLIANT, HRP-7 |
| 文件頁數(shù)： | 8/18頁 |
| 文件大?。?/td> | 484K |
| 代理商： | BD9007HFP |
BD9006F, BD9006HFP, BD9007F, BD9007HFP
Technical Note
16/17
www.rohm.com
2009.05 - Rev.A
2009 ROHM Co., Ltd. All rights reserved.
8. GND wiring pattern
It is recommended to separate the large-current GND pattern from the small-signal GND pattern and establish a single
ground at the reference point of the set PCB, so that resistance to the wiring pattern and voltage fluctuations due to a
large current will cause on fluctuations in voltages of the small-signal GND. Prevent fluctuations in the GND wiring pattern
of external parts.
9. Temperature protection (thermal shut down) circuit
This IC has a built-in temperature protection circuit to prevent the thermal destruction of the IC. As described above, be
sure to use this IC within the power dissipation range. Should a condition exceeding the power dissipation range continue,
the chip temperature Tj will rise to activate the temperature protection circuit, thus turning OFF the output power element.
Then, when the tip temperature Tj falls, the circuit will be automatically reset. Furthermore, if the temperature protection
circuit is activated under the condition exceeding the absolute maximum ratings, do not attempt to use the temperature
protection circuit for set design.
10. On the application shown below, if there is a mode in which VIN and each pin potential are inverted, for example, if the
VIN is short-circuited to the Ground with external diode charged, internal circuits may be damaged. To avoid damage, it is
recommended to insert a backflow prevention diode in the series with VIN or a bypass diode between each pin and VIN.
Fig.30
●
Thermal reduction characteristics
HRP7
SOP8
①
Single piece of IC
①
Single piece of IC
PCB Size: 70×70×1.6mm
3
(PCB incorporates thermal via)
②
When mounted on ROHM standard PCB
Copper foil area on the front side of PCB: 10.5×10.5mm
2
(Glass epoxy PCB of 70mm×70mm×1.6mm)
②
2-layer PCB (Copper foil area on the reverse side of PCB: 15×15mm2)
③
2-layer PCB (Copper foil area on the reverse side of PCB: 70×70mm2)
④
4-layer PCB (Copper foil area on the reverse side of PCB: 70×70mm2)
Fig.31
Fig.32
Backflow prevention diode
Vcc
Pin
Bypass diode
8
10
④
7.3W
③
5.5W
9
7
6
5
4
3
2
1
0
②
2.3W
PO
WER
DISSIP
A
TION
：
PD
[W]
AMBIENT TEMPERATURE：Ta [℃]
25
50
75
100
125
150
①
1.4W
0.8
②
0.7
0.6
0.5
0.4
0.3
0.2
0.1
0
PO
WER
DISSIP
A
TION
：
PD
[W]
AMBIENT TEMPERATURE：Ta [℃]
25
50
75
100
125
150
①
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相關(guān)代理商/技術(shù)參數(shù) |
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|---|---|
| BD9007HFP-TR | 功能描述:開關(guān)變換器、穩(wěn)壓器與控制器 Flexible Step-Down RoHS:否 制造商:Texas Instruments 輸出電壓:1.2 V to 10 V 輸出電流:300 mA 輸出功率: 輸入電壓:3 V to 17 V 開關(guān)頻率:1 MHz 工作溫度范圍: 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:WSON-8 封裝:Reel |
| BD9009HFP | 制造商:ROHM 制造商全稱:Rohm 功能描述:Silicon Monolithic Integrated Circuit |
| BD9009HFP-TR | 功能描述:IC REG BUCK ADJ 4A HRP7 RoHS:是 類別:集成電路 (IC) >> PMIC - 穩(wěn)壓器 - DC DC 開關(guān)穩(wěn)壓器 系列:- 標(biāo)準(zhǔn)包裝:250 系列:- 類型:降壓（降壓） 輸出類型:固定 輸出數(shù):1 輸出電壓:1.2V 輸入電壓:2.05 V ~ 6 V PWM 型:電壓模式 頻率 - 開關(guān):2MHz 電流 - 輸出:500mA 同步整流器:是 工作溫度:-40°C ~ 85°C 安裝類型:表面貼裝 封裝/外殼:6-UFDFN 包裝:帶卷 (TR) 供應(yīng)商設(shè)備封裝:6-SON（1.45x1） 產(chǎn)品目錄頁面:1032 (CN2011-ZH PDF) 其它名稱:296-25628-2 |
| BD900A | 功能描述:達林頓晶體管 70W PNP Silicon RoHS:否 制造商:Texas Instruments 配置:Octal 晶體管極性:NPN 集電極—發(fā)射極最大電壓 VCEO:50 V 發(fā)射極 - 基極電壓 VEBO: 集電極—基極電壓 VCBO: 最大直流電集電極電流:0.5 A 最大集電極截止電流: 功率耗散: 最大工作溫度:+ 150 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:SOIC-18 封裝:Reel |
| BD900A-S | 功能描述:達林頓晶體管 80V 8A PNP RoHS:否 制造商:Texas Instruments 配置:Octal 晶體管極性:NPN 集電極—發(fā)射極最大電壓 VCEO:50 V 發(fā)射極 - 基極電壓 VEBO: 集電極—基極電壓 VCBO: 最大直流電集電極電流:0.5 A 最大集電極截止電流: 功率耗散: 最大工作溫度:+ 150 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:SOIC-18 封裝:Reel |
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