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參數(shù)資料
| 型號： | BD9007HFP |
| 元件分類： | 穩(wěn)壓器 |
| 英文描述： | 2 A SWITCHING REGULATOR, 505 kHz SWITCHING FREQ-MAX, PSSO7 |
| 封裝： | ROHS COMPLIANT, HRP-7 |
| 文件頁數(shù)： | 6/18頁 |
| 文件大?。?/td> | 484K |
| 代理商： | BD9007HFP |
BD9006F, BD9006HFP, BD9007F, BD9007HFP
Technical Note
14/17
www.rohm.com
2009.05 - Rev.A
2009 ROHM Co., Ltd. All rights reserved.
<Reference>
Measurement of open loop of the DC/DC converter
To measure the open loop of the DC/DC converter, use the gain phase
analyzer or FRA to measure the frequency characteristics.
<Procedure>
1. Check to ensure output causes no oscillation at the maximum
load inclosed loop.
2. Isolate ① and ②and insert Vm
(with amplitude of approximately.100mVpp).
3. Measure (probe) the oscillation of ① to that of ②.
※
Please contact us if you have any questions regarding phase compensation.
●
Heat Loss
For thermal design, be sure to operate the IC within the following conditions.
(Since the temperatures described hereunder are all guaranteed temperature, take margin into account.)
1. The ambient temperature Ta is to be 105℃ or less.
2. The chip junction temperature Tj is to be 150℃ or less.
The chip junction temperature Tj can be considered in the following two patterns:
To obtain Tj from the IC surface temperature TC in actual use state, Tj=Ta+θj－a×W
< Reference value > θj－c :HRP7
7℃/W
SOP8 32.5℃/W
To obtain Tj from the ambient temperature Ta in actual use state,Tj=TC+θj－c×W
< Reference. value >
θj－a :
HRP7 89.3℃/W Single piece of IC
54.3℃/W 2-layer PCB (Copper foil area on the front side of PCB: 15×15mm
2)
22.7℃/W 2-layer PCB (Copper foil area on the front side of PCB: 70×70mm
2)
PCB size: 70×70×1.6mm
3 (PCB incorporates thermal via.)
Copper foil area on the front side of PCB: 10.5×10.5mm
2
θj－a :
SOP8 222.2℃/W Single piece of IC
181.8℃/W 1-layer PCB
PCB size: 70×70×1.6mm
3
The heat loss W of the IC can be obtained by the formula shown below:
W = Ron × Io
2 ×
Vo
+ VIN × Icc + Tr × VIN × Io × f
VIN
Ron: ON resistance of IC (refer to page.4)
Io: Load current
Vo: Output voltage
VIN: Input voltage ICC: Circuit current (refer to page.3)
Tr: Switching rise/fall time (approximately 20nsec)
f: Oscillation frequency
Furthermore, the phase margin can also be measured with the load
responsiveness. Measure variations in the output voltage when
instantaneously changing the load from no load to the maximum load. Even
though ringing phenomenon is caused, due to low phase margin, no ringing
takes place. Phase margin is provided. However, no specific phase margin
can be probed.
①
Ron × Io
2
②
2×
2
1
× Tr ×
T
1
× VIN ×Io
=Tr ×VIN × Io× f
GND
SW wave from
VIN
Tr
1
2
T=
1
f
Inadequate phase margin
Adequate phase margin
0
Load
Maximum load
Output
voltage
t
0
RL
DC/DC converter
controller
+
VO
①
②
①
②
Vm
+
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| BD9007HFP-TR | 功能描述:開關(guān)變換器、穩(wěn)壓器與控制器 Flexible Step-Down RoHS:否 制造商:Texas Instruments 輸出電壓:1.2 V to 10 V 輸出電流:300 mA 輸出功率: 輸入電壓:3 V to 17 V 開關(guān)頻率:1 MHz 工作溫度范圍: 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:WSON-8 封裝:Reel |
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| BD9009HFP-TR | 功能描述:IC REG BUCK ADJ 4A HRP7 RoHS:是 類別:集成電路 (IC) >> PMIC - 穩(wěn)壓器 - DC DC 開關(guān)穩(wěn)壓器 系列:- 標(biāo)準(zhǔn)包裝:250 系列:- 類型:降壓（降壓） 輸出類型:固定 輸出數(shù):1 輸出電壓:1.2V 輸入電壓:2.05 V ~ 6 V PWM 型:電壓模式 頻率 - 開關(guān):2MHz 電流 - 輸出:500mA 同步整流器:是 工作溫度:-40°C ~ 85°C 安裝類型:表面貼裝 封裝/外殼:6-UFDFN 包裝:帶卷 (TR) 供應(yīng)商設(shè)備封裝:6-SON（1.45x1） 產(chǎn)品目錄頁面:1032 (CN2011-ZH PDF) 其它名稱:296-25628-2 |
| BD900A | 功能描述:達(dá)林頓晶體管 70W PNP Silicon RoHS:否 制造商:Texas Instruments 配置:Octal 晶體管極性:NPN 集電極—發(fā)射極最大電壓 VCEO:50 V 發(fā)射極 - 基極電壓 VEBO: 集電極—基極電壓 VCBO: 最大直流電集電極電流:0.5 A 最大集電極截止電流: 功率耗散: 最大工作溫度:+ 150 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:SOIC-18 封裝:Reel |
| BD900A-S | 功能描述:達(dá)林頓晶體管 80V 8A PNP RoHS:否 制造商:Texas Instruments 配置:Octal 晶體管極性:NPN 集電極—發(fā)射極最大電壓 VCEO:50 V 發(fā)射極 - 基極電壓 VEBO: 集電極—基極電壓 VCBO: 最大直流電集電極電流:0.5 A 最大集電極截止電流: 功率耗散: 最大工作溫度:+ 150 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:SOIC-18 封裝:Reel |
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