參數(shù)資料
型號: AM45DL3208G
廠商: Advanced Micro Devices, Inc.
元件分類: SRAM
英文描述: Stacked Multi-Chip Package (MCP) Flash Memory and SRAM
中文描述: 堆疊式多芯片封裝(MCP)閃存和SRAM
文件頁數(shù): 6/66頁
文件大小: 1196K
代理商: AM45DL3208G
4
Am45DL3208G
March 12, 2004
P R E L I M I N A R Y
Flash Data Retention . . . . . . . . . . . . . . . . . . . . . . 60
SRAM Data Retention . . . . . . . . . . . . . . . . . . . . . . 61
Figure 34. CE1#s Controlled Data Retention Mode........................ 61
Figure 35. CE2s Controlled Data Retention Mode.......................... 61
Physical Dimensions . . . . . . . . . . . . . . . . . . . . . . 62
FLB073—73-Ball Fine-Pitch Grid Array 8 x 11.6 mm .............62
Revision Summary . . . . . . . . . . . . . . . . . . . . . . . . 63
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相關(guān)代理商/技術(shù)參數(shù)
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AM45DL3208GB70IS 制造商:AMD 制造商全稱:Advanced Micro Devices 功能描述:Stacked Multi-Chip Package (MCP) Flash Memory and SRAM
AM45DL3208GB70IT 制造商:AMD 制造商全稱:Advanced Micro Devices 功能描述:Stacked Multi-Chip Package (MCP) Flash Memory and SRAM
AM45DL3208GB85IS 制造商:AMD 制造商全稱:Advanced Micro Devices 功能描述:Stacked Multi-Chip Package (MCP) Flash Memory and SRAM
AM45DL3208GB85IT 制造商:AMD 制造商全稱:Advanced Micro Devices 功能描述:Stacked Multi-Chip Package (MCP) Flash Memory and SRAM
AM45DL3208GT70IS 制造商:AMD 制造商全稱:Advanced Micro Devices 功能描述:Stacked Multi-Chip Package (MCP) Flash Memory and SRAM