參數(shù)資料
型號: AM45DL3208G
廠商: Advanced Micro Devices, Inc.
元件分類: SRAM
英文描述: Stacked Multi-Chip Package (MCP) Flash Memory and SRAM
中文描述: 堆疊式多芯片封裝(MCP)閃存和SRAM
文件頁數(shù): 51/66頁
文件大小: 1196K
代理商: AM45DL3208G
March 12, 2004
Am45DL3208G
49
P R E L I M I N A R Y
FLASH AC CHARACTERISTICS
OE#
WE#
Addresses
t
OH
Data
Valid
In
Valid
In
Valid PA
Valid RA
t
WC
t
WPH
t
AH
t
WP
t
DS
t
DH
t
RC
t
CE
Valid
Out
t
OE
t
ACC
t
OEH
t
GHWL
t
DF
Valid
In
CE#f Controlled Write Cycles
WE# Controlled Write Cycle
Valid PA
Valid PA
t
CP
t
CPH
t
WC
t
WC
Read Cycle
t
SR/W
CE#f
Figure 22.
Back-to-back Read/Write Cycle Timings
WE#
CE#f
OE#
High Z
t
OE
High Z
DQ7
DQ0–DQ6
RY/BY#
t
BUSY
Complement
True
Addresses
VA
t
OEH
t
CE
t
CH
t
OH
t
DF
VA
VA
Status Data
Complement
Status Data
True
Valid Data
Valid Data
t
ACC
t
RC
Note:
VA = Valid address. Illustration shows first status cycle after command sequence, last status read cycle, and array data
read cycle.
Figure 23.
Data# Polling Timings (During Embedded Algorithms)
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相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
AM45DL3208GB70IS 制造商:AMD 制造商全稱:Advanced Micro Devices 功能描述:Stacked Multi-Chip Package (MCP) Flash Memory and SRAM
AM45DL3208GB70IT 制造商:AMD 制造商全稱:Advanced Micro Devices 功能描述:Stacked Multi-Chip Package (MCP) Flash Memory and SRAM
AM45DL3208GB85IS 制造商:AMD 制造商全稱:Advanced Micro Devices 功能描述:Stacked Multi-Chip Package (MCP) Flash Memory and SRAM
AM45DL3208GB85IT 制造商:AMD 制造商全稱:Advanced Micro Devices 功能描述:Stacked Multi-Chip Package (MCP) Flash Memory and SRAM
AM45DL3208GT70IS 制造商:AMD 制造商全稱:Advanced Micro Devices 功能描述:Stacked Multi-Chip Package (MCP) Flash Memory and SRAM