參數(shù)資料
型號(hào)： AM41DL6408G70IS
廠商： SPANSION LLC
元件分類： 存儲(chǔ)器
英文描述： Stacked Multi-Chip Package (MCP) Flash Memory and SRAM
中文描述： SPECIALTY MEMORY CIRCUIT, PBGA73
封裝： 8 X 11.60 MM, FBGA-73
文件頁數(shù)： 8/63頁
文件大?。?/td> 1139K
代理商： AM41DL6408G70IS
August 19, 2002
Am41DL6408G
7
P R E L I M I N A R Y
CONNECTION DIAGRAM
Special Handling Instructions for FBGA
Package
Special handling is required for Flash Memory products
in FBGA packages.
Flash memory devices in FBGA packages may be
damaged if exposed to ultrasonic cleaning methods.
The package and/or data integrity may be compromised
if the package body is exposed to temperatures above
150
°
C for prolonged periods of time.
A1
B1
C1
F1
G1
L1
M1
D2
E2
F2
G2
H2
J2
C3
D3
E3
F3
G3
H3
J3
K3
C4
D4
E4
F4
G4
H4
J4
K4
B5
C5
D5
E5
H5
J5
K5
L5
B6
C6
D6
E6
H6
J6
K6
L6
C7
D7
E7
F7
G7
H7
J7
K7
C8
D8
E8
F8
G8
H8
J8
K8
D9
E9
F9
G9
H9
J9
A10
B10
F10
G10
L10
M10
NC
NC
NC
NC
NC
NC
NC
NC
NC
A3
A2
A1
A0
CE#f
CE1#s
A7
A6
A5
A4
V
SS
OE#
DQ0
DQ8
LB#
UB#
A18
A17
DQ1
DQ9
DQ10
DQ2
NC
WP#/ACC
RESET#
RY/BY#
DQ3
V
CC
f
DQ11
NC
WE#
CE2s
A20
DQ4
V
CC
s
CIOs
A8
A19
A9
A10
DQ6
DQ13
DQ12
DQ5
A11
A12
A13
A14
SA
DQ15/A-1
DQ7
DQ14
A15
A21
NC
A16
CIOf
V
SS
NC
NC
NC
NC
NC
NC
SRAM only
Shared
Flash only
73-Ball FBGA
Top View
相關(guān)PDF資料
PDF描述
AM41DL6408G70IT Stacked Multi-Chip Package (MCP) Flash Memory and SRAM
AM42BDS640AGBC9IT Stacked Multi-Chip Package (MCP) Flash Memory and SRAM
AM42BDS640AGTC8IS Stacked Multi-Chip Package (MCP) Flash Memory and SRAM
AM42BDS640AGTC8IT Circular Connector; No. of Contacts:13; Series:MS27468; Body Material:Aluminum; Connecting Termination:Crimp; Connector Shell Size:11; Circular Contact Gender:Pin; Circular Shell Style:Jam Nut Receptacle; Insert Arrangement:11-35 RoHS Compliant: No
AM42BDS640AGTC9IS LJT 13C 13#22D PIN WALL RECP
相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
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AM41DL6408G71IS 制造商:SPANSION 制造商全稱:SPANSION 功能描述:Stacked Multi-Chip Package (MCP) Flash Memory and SRAM
AM41DL6408G71IT 制造商:SPANSION 制造商全稱:SPANSION 功能描述:Stacked Multi-Chip Package (MCP) Flash Memory and SRAM
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