參數資料
型號: AM41DL6408G70IS
廠商: SPANSION LLC
元件分類: 存儲器
英文描述: Stacked Multi-Chip Package (MCP) Flash Memory and SRAM
中文描述: SPECIALTY MEMORY CIRCUIT, PBGA73
封裝: 8 X 11.60 MM, FBGA-73
文件頁數: 1/63頁
文件大小: 1139K
代理商: AM41DL6408G70IS
July 2003
The following document specifies Spansion memory products that are now offered by both Advanced
Micro Devices and Fujitsu. Although the document is marked with the name of the company that orig-
inally developed the specification, these products will be offered to customers of both AMD and
Fujitsu.
Continuity of Specifications
There is no change to this datasheet as a result of offering the device as a Spansion product. Any
changes that have been made are the result of normal datasheet improvement and are noted in the
document revision summary, where supported. Future routine revisions will occur when appropriate,
and changes will be noted in a revision summary.
Continuity of Ordering Part Numbers
AMD and Fujitsu continue to support existing part numbers beginning with “Am” and “MBM”. To order
these products, please use only the Ordering Part Numbers listed in this document.
For More Information
Please contact your local AMD or Fujitsu sales office for additional information about Spansion
memory solutions.
Am41DL6408G
Data Sheet
Publication Number
25560
Revision
B
Amendment
0
Issue Date
August 19, 2002
相關PDF資料
PDF描述
AM41DL6408G70IT Stacked Multi-Chip Package (MCP) Flash Memory and SRAM
AM42BDS640AGBC9IT Stacked Multi-Chip Package (MCP) Flash Memory and SRAM
AM42BDS640AGTC8IS Stacked Multi-Chip Package (MCP) Flash Memory and SRAM
AM42BDS640AGTC8IT Circular Connector; No. of Contacts:13; Series:MS27468; Body Material:Aluminum; Connecting Termination:Crimp; Connector Shell Size:11; Circular Contact Gender:Pin; Circular Shell Style:Jam Nut Receptacle; Insert Arrangement:11-35 RoHS Compliant: No
AM42BDS640AGTC9IS LJT 13C 13#22D PIN WALL RECP
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