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參數(shù)資料
| 型號： | AM41DL6408G70IS |
| 廠商： | SPANSION LLC |
| 元件分類： | 存儲器 |
| 英文描述： | Stacked Multi-Chip Package (MCP) Flash Memory and SRAM |
| 中文描述： | SPECIALTY MEMORY CIRCUIT, PBGA73 |
| 封裝： | 8 X 11.60 MM, FBGA-73 |
| 文件頁數(shù)： | 63/63頁 |
| 文件大小： | 1139K |
| 代理商： | AM41DL6408G70IS |
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62
Am41DL6408G
August 19, 2002
P R E L I M I N A R Y
REVISION SUMMARY
Revision A (October 24, 2001)
Initial release.
Revision A+1 (November 26, 2001)
Global
The abbreviation for Sector Address has been
changed from SA to SADD.
Connection Diagrams
Changed ball E4 to “Shared” coloring.
Tables 1–4, Device Bus Operations
Added Table 4. Changed formatting and specifications
to be consistent with other AMD flash memory mu-
lit-chip offerings.
Table 6, Bank Address
Added table.
Table 13, Primary Vendor-Specific Extended Query
Modified descriptions for addresses 4Ah, 4Fh. Deleted
note.
Table 14, Am29DL640G Command Definitions
Corrected descriptions for SADD and BA in legend.
Clarified Note 5.
DC Characteristics table
Changed minimum specification for V
ID
.
Flash Read-Only Operations table
Changes maximum t
OE
for 85 ns SRAM.
Erase and Program Operations table, Alternate
CE#f Controlled Erase and Program Operations
table
Changed t
AH
specification for both 70 and 85 ns.
Changed t
DS
for 70 ns, t
WHWH1
, t
WHWH2
, and t
BUSY
.
Flash Erase And Programming Performance table
Changed typical and maximum specifications for sec-
tor erase time. Changed typical specification of chip
erase.
Revision B (August 19, 2002)
Global
Added 55 ns SRAM speed grade.
MCP Block Diagram
Removed A-1 from DQ15/A-1 input to Flash Memory
and SRAM
Trademarks
Copyright 2002 Advanced Micro Devices, Inc. All rights reserved.
AMD, the AMD logo, and combinations thereof are registered trademarks of Advanced Micro Devices, Inc.
ExpressFlash is a trademark of Advanced Micro Devices, Inc.
Product names used in this publication are for identification purposes only and may be trademarks of their respective companies.
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| AM41DL6408G70IT | Stacked Multi-Chip Package (MCP) Flash Memory and SRAM |
| AM42BDS640AGBC9IT | Stacked Multi-Chip Package (MCP) Flash Memory and SRAM |
| AM42BDS640AGTC8IS | Stacked Multi-Chip Package (MCP) Flash Memory and SRAM |
| AM42BDS640AGTC8IT | Circular Connector; No. of Contacts:13; Series:MS27468; Body Material:Aluminum; Connecting Termination:Crimp; Connector Shell Size:11; Circular Contact Gender:Pin; Circular Shell Style:Jam Nut Receptacle; Insert Arrangement:11-35 RoHS Compliant: No |
| AM42BDS640AGTC9IS | LJT 13C 13#22D PIN WALL RECP |
相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| AM41DL6408G70IT | 制造商:SPANSION 制造商全稱:SPANSION 功能描述:Stacked Multi-Chip Package (MCP) Flash Memory and SRAM |
| AM41DL6408G71IS | 制造商:SPANSION 制造商全稱:SPANSION 功能描述:Stacked Multi-Chip Package (MCP) Flash Memory and SRAM |
| AM41DL6408G71IT | 制造商:SPANSION 制造商全稱:SPANSION 功能描述:Stacked Multi-Chip Package (MCP) Flash Memory and SRAM |
| AM41DL6408G85I | 制造商:Spansion 功能描述:COMBO 4MX16/8MX8 FLASH + 512KX16/1MX8 SRAM 3V/3.3V 73FBGA - Trays |
| AM41DL6408G85IS | 制造商:SPANSION 制造商全稱:SPANSION 功能描述:Stacked Multi-Chip Package (MCP) Flash Memory and SRAM |
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