參數(shù)資料
型號： AM29LV2562M
廠商： Spansion Inc.
英文描述： 512 Megabit (16 M x 32-Bit/32 M x 16-Bit) MirrorBit 3.0 Volt-only Uniform Sector Flash Memory with VersatileI/O Control
中文描述： 512兆位（16 M中的x 32-Bit/32 M中的x 16位）的MirrorBit 3.0伏特，只有統(tǒng)一閃存部門與VersatileI / O控制
文件頁數(shù)： 5/69頁
文件大?。?/td> 1451K
代理商： AM29LV2562M
October 9, 2003
Am29LV2562M
3
P R E L I M I N A R Y
TABLE OF CONTENTS
Product Selector Guide. . . . . . . . . . . . . . . . . . . . . 4
MCP Block Diagram. . . . . . . . . . . . . . . . . . . . . . . . 4
Special Package Handling Instructions ....................................6
Logic Symbols . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
x16 Mode ..................................................................................7
x32 Mode ..................................................................................7
Table 1. Device Bus Operations ....................................................... 9
VersatileIO
Requirements for Reading Array Data ...................................10
Page Mode Read ............................................................................10
Writing Commands/Command Sequences ............................10
Write Buffer .....................................................................................10
Accelerated Program Operation ......................................................10
Autoselect Functions .......................................................................10
Automatic Sleep Mode ...........................................................11
RESET#: Hardware Reset Pin ...............................................11
Output Disable Mode ..............................................................11
Table 2. Sector Address Table........................................................ 12
Table 3. Autoselect Codes, (High Voltage Method) ....................... 23
Sector Group Protection and Unprotection .............................24
Table 4. Sector Group Protection/Unprotection Address Table ..... 24
Temporary Sector Group Unprotect .......................................26
Figure 1. Temporary Sector Group Unprotect Operation ................26
Figure 2. In-System Sector Group Protect/Unprotect Algorithms ...27
SecSi (Secured Silicon) Sector Flash Memory Region ..........28
Table 5. SecSi Sector Contents...................................................... 28
Figure 3. SecSi Sector Protect Verify ..............................................29
Hardware Data Protection ......................................................29
Low VCC Write Inhibit .....................................................................29
Write Pulse “Glitch” Protection ........................................................29
Logical Inhibit ..................................................................................29
Power-Up Write Inhibit ....................................................................29
Common Flash Memory Interface (CFI). . . . . . . 29
Reading Array Data ................................................................33
Reset Command .....................................................................33
Autoselect Command Sequence ............................................33
Enter SecSi Sector/Exit SecSi Sector Command Sequence ..34
Doubleword/Word Program Command Sequence .................34
Unlock Bypass Command Sequence ..............................................34
Write Buffer Programming ...............................................................34
Accelerated Program ......................................................................35
Figure 4. Write Buffer Programming Operation ...............................36
Figure 5. Program Operation ..........................................................37
Program Suspend/Program Resume Command Sequence ...37
Figure 6. Program Suspend/Program Resume ...............................38
TM
(V
IO
) Control ........................................................9
Chip Erase Command Sequence ...........................................38
Sector Erase Command Sequence ........................................38
Figure 7. Erase Operation .............................................................. 39
Erase Suspend/Erase Resume Commands ...........................39
DQ7 and DQ5: Data# Polling ..................................................43
Figure 7. Data# Polling Algorithm .................................................. 43
DQ6 and DQ14: Toggle Bits I .................................................44
Figure 8. Toggle Bit Algorithm ........................................................ 45
DQ2 and DQ10: Toggle Bits II ................................................45
Reading Toggle Bits DQ6 and DQ14/DQ2 and DQ10 ............45
DQ5 and DQ13: Exceeded Timing Limits ...............................46
DQ3 and DQ11: Sector Erase Timer ......................................46
DQ1: Write-to-Buffer Abort .....................................................47
Table 12. Write Operation Status................................................... 47
Figure 9. Maximum Negative Overshoot Waveform ..................... 48
Figure 10. Maximum Positive Overshoot Waveform ..................... 48
Figure 11. Test Setup ..................................................................... 50
Table 13. Test Specifications......................................................... 50
Key to Switching Waveforms. . . . . . . . . . . . . . . . 50
Figure 12. Input Waveforms and
Measurement Levels ...................................................................... 50
Read-Only Operations ...........................................................51
Figure 13. Read Operation Timings ............................................... 51
Figure 14. Page Read Timings ...................................................... 52
Hardware Reset (RESET#) ....................................................53
Figure 15. Reset Timings ............................................................... 53
Erase and Program Operations ..............................................54
Figure 16. Program Operation Timings .......................................... 55
Figure 17. Accelerated Program Timing Diagram .......................... 55
Figure 18. Chip/Sector Erase Operation Timings .......................... 56
Figure 19. Data# Polling Timings (During Embedded Algorithms) . 57
Figure 20. Toggle Bit Timings (During Embedded Algorithms) ...... 58
Figure 21. DQ2 vs. DQ6 ................................................................. 58
Temporary Sector Unprotect ..................................................59
Figure 22. Temporary Sector Group Unprotect Timing Diagram ... 59
Figure 23. Sector Group Protect and Unprotect Timing Diagram .. 60
Alternate CE# Controlled Erase and Program Operations .....61
Figure 24. Alternate CE# Controlled Write (Erase/Program)
Operation Timings .......................................................................... 62
Latchup Characteristics. . . . . . . . . . . . . . . . . . . . 62
Erase And Programming Performance. . . . . . . . 63
TSOP Pin and BGA Package Capacitance . . . . . 63
Data Retention. . . . . . . . . . . . . . . . . . . . . . . . . . . . 63
LSC080–80-Ball Fortified Ball Grid Array
18 x 12 mm Package ..............................................................64
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