參數(shù)資料
型號(hào)： ADP5589CP-EVALZ
廠商： Analog Devices Inc
文件頁數(shù)： 44/52頁
文件大?。?/td> 0K
描述： BOARD EVAL ADP5589ACPZ
標(biāo)準(zhǔn)包裝： 1
主要目的： 接口，GPIO 擴(kuò)展器
已用 IC / 零件： ADP5589
主要屬性： 19 個(gè)可配置的 I/O
次要屬性： I²C 接口
已供物品： 板
Data Sheet
ADP5589
Rev. B | Page 49 of 52
OUTLINE DIMENSIONS
0.40
BSC
0.50
0.40
0.30
0.25
0.20
0.15
COMPLIANT
TO JEDEC STANDARDS MO-220-WFFE.
BOTTOM VIEW
TOP VIEW
EXPOSED
PAD
PIN 1
INDICATOR
3.60
3.50 SQ
3.40
SEATING
PLANE
0.80
0.75
0.70
0.05 MAX
0.02 NOM
0.203 REF
0.20 MIN
COPLANARITY
0.08
PIN 1
INDICATOR
1
24
7
12
13
18
19
6
FOR PROPER CONNECTION OF
THE EXPOSED PAD, REFER TO
THE PIN CONFIGURATION AND
FUNCTION DESCRIPTIONS
SECTION OF THIS DATA SHEET.
2.30
2.20 SQ
2.10
0
4-
13-
2
012
-A
Figure 32. 24-Lead Lead Frame Chip Scale Package [LFCSP_WQ]
3.5 mm × 3.5 mm Body, Very Very Thin Quad
(CP-24-11)
Dimensions shown in millimeters
11-
0
2-
20
12-A
A
B
C
D
E
0.560
0.500
0.440
SIDE VIEW
0.230
0.200
0.170
0.300
0.260
0.220
COPLANARITY
0.05
SEATING
PLANE
1
2
3
4
5
BOTTOM VIEW
(BALL SIDE UP)
TOP VIEW
(BALL SIDE DOWN)
BALL A1
IDENTIFIER
0.40
REF
1.60
REF
2.030
1.990 SQ
1.950
Figure 33. 25-Ball Wafer Level Chip Scale Package [WLCSP]
(CB-25-5)
Dimensions shown in millimeters
ORDERING GUIDE
Temperature Range
Package Description
Package Option
ADP5589ACPZ-00-R7
40°C to +85°C
24-Lead Lead Frame Chip Scale Package[LFCSP_WQ]
CP-24-11
ADP5589ACPZ-01-R7
40°C to +85°C
24-Lead Lead Frame Chip Scale Package[LFCSP_WQ]
CP-24-11
ADP5589ACPZ-02-R7
40°C to +85°C
24-Lead Lead Frame Chip Scale Package[LFCSP_WQ]
CP-24-11
ADP5589ACBZ-00-R7
40°C to +85°C
25-Ball Wafer Level Chip Scale Package[WLCSP]
CB-25-5
ADP5589ACBZ-01-R7
40°C to +85°C
25-Ball Wafer Level Chip Scale Package[WLCSP]
CB-25-5
ADP5589ACBZ-02-R7
40°C to +85°C
25-Ball Wafer Level Chip Scale Package[WLCSP]
CB-25-5
ADP5589CP-EVALZ
Evaluation Board
1 Z = RoHS Compliant Part.
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