參數(shù)資料
型號： ADAU1442YSVZ-3A
廠商： Analog Devices Inc
文件頁數(shù)： 87/93頁
文件大小： 0K
描述： IC SIGMADSP 28B 175MHZ 100TQFP
標(biāo)準(zhǔn)包裝： 1
系列： SigmaDSP®
類型： 音頻處理器
應(yīng)用： 車載音頻
安裝類型： 表面貼裝
封裝/外殼： 100-TQFP 裸露焊盤
供應(yīng)商設(shè)備封裝： 100-TQFP-EP（14x14）
包裝： 托盤
Data Sheet
ADAU1442/ADAU1445/ADAU1446
Rev. D | Page 87 of 92
APPLICATIONS INFORMATION
LAYOUT RECOMMENDATIONS
Parts Placement
All 100 nF bypass capacitors, which are recommended for every
analog, digital, and PLL power-ground pair, should be placed as
close to the ADAU1442/ADAU1445/ADAU1446 as possible.
The AVDD, DVDD, PVDD, and IOVDD supply signals on the
board should each be bypassed with an additional single bulk
capacitor (10 μF to 47 μF).
All traces in the crystal oscillator circuit (Figure 9) should be
kept as short as possible to minimize stray capacitance. There
should not be any long board traces connected to crystal
oscillator circuit components because such traces may affect
crystal startup and operation.
Grounding
A single ground plane should be used in the application layout.
Components in an analog signal path should be placed away
from digital signals.
Exposed Pad PCB Design
The ADAU1442 and ADAU1445 packages include an exposed pad
for improved heat dissipation. When designing a board for such
a package, special consideration should be given to the following:
A copper layer equal in size to the exposed pad should be
on all layers of the board, from top to bottom, and should
connect somewhere to a dedicated copper board layer (see
Vias should be placed to connect all layers of copper, allowing
for efficient heat and energy conductivity. For an example,
see Figure 61, which has 16 vias arranged in a 4 × 4 grid in
the pad area.
07696-
067
TOP
POWER
GROUND
BOTTOM
COPPER SQUARES
VIAS
Figure 60. Exposed Pad Layout Example—Side View
07696-
066
Figure 61. Exposed Pad Layout Example—Top View
PLL Loop Filter
The single resistor and two capacitors in the PLL loop filter
should be connected to the PLL_FILT and PVDD pins with
short traces to minimize jitter.
Power Supply Bypass Capacitors
Each power supply pin should be bypassed to its nearest
appropriate ground pin with a single 100 nF capacitor. The
connections to each side of the capacitor should be as short as
possible, and the trace should stay on a single layer with no vias.
For maximum effectiveness, the capacitor should preferably be
located either equidistant from the power and ground pins or,
when equidistant placement is not possible, slightly closer to the
power pin. Thermal connections to the planes should be made
on the far side of the capacitor.
POWER GROUND
TO GROUND
TO POWER
CAPACITOR
07696-
061
Figure 62. Recommended Power Supply Bypass Capacitor Layout
EOS/ESD Protection
Although the ADAU1442/ADAU1445/ADAU1446 have robust
internal protection circuitry against overvoltages and electrostatic
discharge, an external transient voltage suppressor (TVS) is
recommended for all systems to prevent damage to the IC.
Examples can be found in the AN-311 Application Note on the
Analog Devices website.
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ADAU1442YSVZ-3A-RL 功能描述:IC SIGMADSP 28B 175MHZ 100TQFP RoHS:是 類別:集成電路 (IC) >> 線性 - 音頻處理 系列:SigmaDSP® 其它有關(guān)文件:STA321 View All Specifications 標(biāo)準(zhǔn)包裝:1 系列:Sound Terminal™ 類型:音頻處理器 應(yīng)用:數(shù)字音頻 安裝類型:表面貼裝 封裝/外殼:64-LQFP 裸露焊盤 供應(yīng)商設(shè)備封裝:64-LQFP EP（10x10） 包裝:Digi-Reel® 其它名稱:497-11050-6
ADAU1445YSVZ-3A 功能描述:IC SIGMADSP 175MHZ 100TQFP RoHS:是 類別:集成電路 (IC) >> 線性 - 音頻處理 系列:SigmaDSP® 其它有關(guān)文件:STA321 View All Specifications 標(biāo)準(zhǔn)包裝:1 系列:Sound Terminal™ 類型:音頻處理器 應(yīng)用:數(shù)字音頻 安裝類型:表面貼裝 封裝/外殼:64-LQFP 裸露焊盤 供應(yīng)商設(shè)備封裝:64-LQFP EP（10x10） 包裝:Digi-Reel® 其它名稱:497-11050-6
ADAU1445YSVZ-3A-RL 功能描述:IC SIGMADSP 175MHZ 100TQFP RoHS:是 類別:集成電路 (IC) >> 線性 - 音頻處理 系列:SigmaDSP® 其它有關(guān)文件:STA321 View All Specifications 標(biāo)準(zhǔn)包裝:1 系列:Sound Terminal™ 類型:音頻處理器 應(yīng)用:數(shù)字音頻 安裝類型:表面貼裝 封裝/外殼:64-LQFP 裸露焊盤 供應(yīng)商設(shè)備封裝:64-LQFP EP（10x10） 包裝:Digi-Reel® 其它名稱:497-11050-6
ADAU1446EBZ 制造商:Analog Devices 功能描述:SIGMADSP? DIGITAL AUDIO PROCESSOR WITH FLEXIBLE AUDIO - Bulk
ADAU1446YSTZ-3A 功能描述:IC SIGMADSP 175MHZ 100LQFP RoHS:是 類別:集成電路 (IC) >> 線性 - 音頻處理 系列:SigmaDSP® 其它有關(guān)文件:STA321 View All Specifications 標(biāo)準(zhǔn)包裝:1 系列:Sound Terminal™ 類型:音頻處理器 應(yīng)用:數(shù)字音頻 安裝類型:表面貼裝 封裝/外殼:64-LQFP 裸露焊盤 供應(yīng)商設(shè)備封裝:64-LQFP EP（10x10） 包裝:Digi-Reel® 其它名稱:497-11050-6
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