參數(shù)資料
型號: AD7148ACPZ-1500RL7
廠商: Analog Devices Inc
文件頁數(shù): 26/57頁
文件大?。?/td> 0K
描述: IC CAP-TO-DGTL CONV PROG 16LFCSP
標(biāo)準(zhǔn)包裝: 1
類型: 電容性
觸摸面板接口: 2 線
輸入數(shù)/鍵: 8
分辨率(位): 16 b
數(shù)據(jù)接口: I²C,串行
數(shù)據(jù)速率/采樣率 (SPS,BPS): 250k
電壓基準(zhǔn): 內(nèi)部
電源電壓: 2.6 V ~ 3.3 V
工作溫度: -40°C ~ 85°C
安裝類型: 表面貼裝
封裝/外殼: 16-VQFN 裸露焊盤,CSP
供應(yīng)商設(shè)備封裝: 16-LFCSP
包裝: 標(biāo)準(zhǔn)包裝
產(chǎn)品目錄頁面: 781 (CN2011-ZH PDF)
其它名稱: AD7148ACPZ-1500RL7DKR
AD7148
Rev. A | Page 31 of 56
PCB DESIGN GUIDELINES
CAPACITIVE SENSOR BOARD MECHANICAL SPECIFICATIONS
Table 16.
Parameter
Symbol
Min
Typ
Max
Unit
Distance from Edge of Any Sensor to Edge of Grounded Metal Object
D1
0.1
mm
Distance Between Sensor Edges1
D2 = D3 = D4
0
mm
Distance Between Bottom of Sensor Board and Controller Board or Grounded
Metal Casing2
D5
1.0
mm
1 The distance is dependent on the application and the positioning of the switches relative to each other and with respect to the user’s finger positioning and handling.
Adjacent sensors, with 0 minimum space between them, are implemented differentially.
2 The 1.0 mm specification is meant to prevent direct sensor board contact with any conductive material. This specification does not guarantee no EMI coupling from
the controller board to the sensors. Address potential EMI coupling issues by placing a grounded metal shield between the capacitive sensor board and the main
controller board, as shown in Figure 43.
0715
5-
0
40
SLIDER
BUTTONS
CAPACITIVE SENSOR
PRINTED CIRCUIT
CAPACITIVE SENSOR BOARD
8-WAY
SWITCH
METAL OBJECT
D5
CONTROLLER PRINTED CIRCUIT BOARD OR METAL CASING
GROUNDED METAL SHIELD
07155-
042
D1
D3
D4
D2
Figure 41. Capacitive Sensor Board Mechanicals Top View
D5
CONTROLLER PRINTED CIRCUIT BOARD OR METAL CASING
0
71
55
-0
41
CAPACITIVE SENSOR BOARD
Figure 42. Capacitive Sensor Board Mechanicals Side View
Figure 43. Capacitive Sensor Board with Grounded Shield
CHIP SCALE PACKAGES
The lands on the chip scale package (CP-16-13) are rectangular.
The printed circuit board pad for this package should be 0.1 mm
longer than the package land length and 0.05 mm wider than
the package land width. Center the land on the pad to maximize
the solder joint size.
The bottom of the chip scale package has a central thermal pad.
The thermal pad on the printed circuit board should be at least
as large as this exposed pad. To avoid shorting, provide a clearance
of at least 0.25 mm between the thermal pad and the inner edges
of the land pattern on the printed circuit board.
Thermal vias can be used on the printed circuit board thermal
pad to improve thermal performance of the package. If vias are
used, they should be incorporated in the thermal pad at a 1.2 mm
pitch grid. The via diameter should be between 0.3 mm and
0.33 mm, and the via barrel should be plated with 1 oz. copper
to plug the via.
Connect the printed circuit board thermal pad to GND.
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