- 您現(xiàn)在的位置：買(mǎi)賣(mài)IC網(wǎng) > PDF目錄36339 > 935273916518 (NXP SEMICONDUCTORS) COLOR SIGNAL DECODER, PBGA156 PDF資料下載
參數(shù)資料
| 型號(hào)： | 935273916518 |
| 廠商： | NXP SEMICONDUCTORS |
| 元件分類(lèi)： | 顏色信號(hào)轉(zhuǎn)換 |
| 英文描述： | COLOR SIGNAL DECODER, PBGA156 |
| 封裝： | 15 X 15 MM, 1.15 MM HEIGHT, LEAD FREE, PLASTIC, MS-034, SOT-472-1, BGA-156 |
| 文件頁(yè)數(shù)： | 78/178頁(yè) |
| 文件大?。?/td> | 988K |
| 代理商： | 935273916518 |
第1頁(yè)第2頁(yè)第3頁(yè)第4頁(yè)第5頁(yè)第6頁(yè)第7頁(yè)第8頁(yè)第9頁(yè)第10頁(yè)第11頁(yè)第12頁(yè)第13頁(yè)第14頁(yè)第15頁(yè)第16頁(yè)第17頁(yè)第18頁(yè)第19頁(yè)第20頁(yè)第21頁(yè)第22頁(yè)第23頁(yè)第24頁(yè)第25頁(yè)第26頁(yè)第27頁(yè)第28頁(yè)第29頁(yè)第30頁(yè)第31頁(yè)第32頁(yè)第33頁(yè)第34頁(yè)第35頁(yè)第36頁(yè)第37頁(yè)第38頁(yè)第39頁(yè)第40頁(yè)第41頁(yè)第42頁(yè)第43頁(yè)第44頁(yè)第45頁(yè)第46頁(yè)第47頁(yè)第48頁(yè)第49頁(yè)第50頁(yè)第51頁(yè)第52頁(yè)第53頁(yè)第54頁(yè)第55頁(yè)第56頁(yè)第57頁(yè)第58頁(yè)第59頁(yè)第60頁(yè)第61頁(yè)第62頁(yè)第63頁(yè)第64頁(yè)第65頁(yè)第66頁(yè)第67頁(yè)第68頁(yè)第69頁(yè)第70頁(yè)第71頁(yè)第72頁(yè)第73頁(yè)第74頁(yè)第75頁(yè)第76頁(yè)第77頁(yè)當(dāng)前第78頁(yè)第79頁(yè)第80頁(yè)第81頁(yè)第82頁(yè)第83頁(yè)第84頁(yè)第85頁(yè)第86頁(yè)第87頁(yè)第88頁(yè)第89頁(yè)第90頁(yè)第91頁(yè)第92頁(yè)第93頁(yè)第94頁(yè)第95頁(yè)第96頁(yè)第97頁(yè)第98頁(yè)第99頁(yè)第100頁(yè)第101頁(yè)第102頁(yè)第103頁(yè)第104頁(yè)第105頁(yè)第106頁(yè)第107頁(yè)第108頁(yè)第109頁(yè)第110頁(yè)第111頁(yè)第112頁(yè)第113頁(yè)第114頁(yè)第115頁(yè)第116頁(yè)第117頁(yè)第118頁(yè)第119頁(yè)第120頁(yè)第121頁(yè)第122頁(yè)第123頁(yè)第124頁(yè)第125頁(yè)第126頁(yè)第127頁(yè)第128頁(yè)第129頁(yè)第130頁(yè)第131頁(yè)第132頁(yè)第133頁(yè)第134頁(yè)第135頁(yè)第136頁(yè)第137頁(yè)第138頁(yè)第139頁(yè)第140頁(yè)第141頁(yè)第142頁(yè)第143頁(yè)第144頁(yè)第145頁(yè)第146頁(yè)第147頁(yè)第148頁(yè)第149頁(yè)第150頁(yè)第151頁(yè)第152頁(yè)第153頁(yè)第154頁(yè)第155頁(yè)第156頁(yè)第157頁(yè)第158頁(yè)第159頁(yè)第160頁(yè)第161頁(yè)第162頁(yè)第163頁(yè)第164頁(yè)第165頁(yè)第166頁(yè)第167頁(yè)第168頁(yè)第169頁(yè)第170頁(yè)第171頁(yè)第172頁(yè)第173頁(yè)第174頁(yè)第175頁(yè)第176頁(yè)第177頁(yè)第178頁(yè)
2004 Jul 22
169
Philips Semiconductors
Product specication
Multistandard video decoder with adaptive
comb lter and component video input
SAA7118
18 SOLDERING
18.1
Introduction to soldering surface mount
packages
This text gives a very brief insight to a complex technology.
A more in-depth account of soldering ICs can be found in
our “Data Handbook IC26; Integrated Circuit Packages”
(document order number 9398 652 90011).
There is no soldering method that is ideal for all surface
mount IC packages. Wave soldering can still be used for
certain surface mount ICs, but it is not suitable for fine pitch
SMDs. In these situations reflow soldering is
recommended.
18.2
Reow soldering
Reflow soldering requires solder paste (a suspension of
fine solder particles, flux and binding agent) to be applied
to the printed-circuit board by screen printing, stencilling or
pressure-syringe dispensing before package placement.
Driven by legislation and environmental forces the
worldwide use of lead-free solder pastes is increasing.
Several methods exist for reflowing; for example,
convection or convection/infrared heating in a conveyor
type oven. Throughput times (preheating, soldering and
cooling) vary between 100 seconds and 200 seconds
depending on heating method.
Typical reflow peak temperatures range from
215
°C to 270 °C depending on solder paste material. The
top-surface temperature of the packages should
preferably be kept:
below 225 °C (SnPb process) or below 245 °C (Pb-free
process)
– for all BGA, HTSSON-T and SSOP-T packages
– for packages with a thickness
≥ 2.5 mm
– for packages with a thickness < 2.5 mm and a
volume
≥ 350 mm3 so called thick/large packages.
below 240 °C (SnPb process) or below 260 °C (Pb-free
process) for packages with a thickness < 2.5 mm and a
volume < 350 mm3 so called small/thin packages.
Moisture sensitivity precautions, as indicated on packing,
must be respected at all times.
18.3
Wave soldering
Conventional single wave soldering is not recommended
for surface mount devices (SMDs) or printed-circuit boards
with a high component density, as solder bridging and
non-wetting can present major problems.
To overcome these problems the double-wave soldering
method was specifically developed.
If wave soldering is used the following conditions must be
observed for optimal results:
Use a double-wave soldering method comprising a
turbulent wave with high upward pressure followed by a
smooth laminar wave.
For packages with leads on two sides and a pitch (e):
– larger than or equal to 1.27 mm, the footprint
longitudinal axis is preferred to be parallel to the
transport direction of the printed-circuit board;
– smaller than 1.27 mm, the footprint longitudinal axis
must be parallel to the transport direction of the
printed-circuit board.
The footprint must incorporate solder thieves at the
downstream end.
For packages with leads on four sides, the footprint must
be placed at a 45
° angle to the transport direction of the
printed-circuit board. The footprint must incorporate
solder thieves downstream and at the side corners.
During placement and before soldering, the package must
be fixed with a droplet of adhesive. The adhesive can be
applied by screen printing, pin transfer or syringe
dispensing. The package can be soldered after the
adhesive is cured.
Typical dwell time of the leads in the wave ranges from
3 seconds to 4 seconds at 250
°C or 265 °C, depending
on solder material applied, SnPb or Pb-free respectively.
A mildly-activated flux will eliminate the need for removal
of corrosive residues in most applications.
18.4
Manual soldering
Fix the component by first soldering two
diagonally-opposite end leads. Use a low voltage (24 V or
less) soldering iron applied to the flat part of the lead.
Contact time must be limited to 10 seconds at up to
300
°C.
When using a dedicated tool, all other leads can be
soldered in one operation within 2 seconds to 5 seconds
between 270
°C and 320 °C.
相關(guān)PDF資料 |
PDF描述 |
|---|---|
| 935273916557 | COLOR SIGNAL DECODER, PBGA156 |
| 935268460118 | 1-CHANNEL, SGL POLE SGL THROW SWITCH, PDSO5 |
| 935268459115 | 1-CHANNEL, SGL POLE SGL THROW SWITCH, PDSO5 |
| 935268459118 | 1-CHANNEL, SGL POLE SGL THROW SWITCH, PDSO5 |
| 935268459125 | 1-CHANNEL, SGL POLE SGL THROW SWITCH, PDSO5 |
相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| 935275527134 | 制造商:NXP Semiconductors 功能描述:IC BUS SWITCH OCTAL QUAD 20TSSOP |
| 935277864112 | 制造商:NXP Semiconductors 功能描述:IC CPU |
| 935278818112 | 制造商:NXP Semiconductors 功能描述:LCD DRVR 20DIGIT 2.5V/3.3V/5V 56-Pin VSO Tube |
| 935280517132 | 制造商:NXP Semiconductors 功能描述:IC TRANSLATING BUFFER 6XSON |
| 935281751112 | 制造商:NXP Semiconductors 功能描述:IC BUFFER/DVR 16BIT 3ST 48TSSOP |
發(fā)布緊急采購(gòu)，3分鐘左右您將得到回復(fù)。