參數(shù)資料
型號: 934020700127
廠商: NXP SEMICONDUCTORS
元件分類: 外設(shè)及接口
英文描述: 80 A BUF OR INV BASED PRPHL DRVR, PSFM3
封裝: PLASTIC, TO-220AB, SOT-78, 3 PIN
文件頁數(shù): 6/11頁
文件大?。?/td> 110K
代理商: 934020700127
Philips Semiconductors
Product specification
PowerMOS transistor
BUK101-50GS
TOPFET
TRANSFER CHARACTERISTICS
T
mb = 25 C
SYMBOL
PARAMETER
CONDITIONS
MIN.
TYP.
MAX.
UNIT
g
fs
Forward transconductance
V
DS = 10 V; IDM = 13 A tp ≤ 300 s;
10
16
-
S
δ ≤ 0.01
I
D(SC)
Drain current
1
V
DS = 13 V; VIS = 10 V
-
80
-
A
SWITCHING CHARACTERISTICS
T
mb = 25 C.
R
I = 50 .
Refer to waveform figures and test circuits.
SYMBOL
PARAMETER
CONDITIONS
MIN.
TYP.
MAX.
UNIT
t
d on
Turn-on delay time
V
DD = 13 V; VIS = 10 V
-
1.5
-
s
t
r
Rise time
resistive load R
L = 2.1
-6
-
s
t
d off
Turn-off delay time
V
DD = 13 V; VIS = 0 V
-
18
-
s
t
f
Fall time
resistive load R
L = 2.1
-9
-
s
t
d on
Turn-on delay time
V
DD = 10 V; VIS = 10 V
-
2
-
s
t
r
Rise time
inductive load I
DM = 6 A
-
1
-
s
t
d off
Turn-off delay time
V
DD = 10 V; VIS = 0 V
-
22
-
s
t
f
Fall time
inductive load I
DM = 6 A
-
1
-
s
REVERSE DIODE LIMITING VALUE
SYMBOL
PARAMETER
CONDITIONS
MIN.
MAX.
UNIT
I
S
Continuous forward current
T
mb ≤ 25 C; VIS = 0 V
-
29
A
REVERSE DIODE CHARACTERISTICS
T
mb = 25 C
SYMBOL
PARAMETER
CONDITIONS
MIN.
TYP.
MAX.
UNIT
V
SDS
Forward voltage
I
S = 29 A; VIS = 0 V; tp = 300 s
-
1.0
1.5
V
t
rr
Reverse recovery time
not applicable
2
--
ENVELOPE CHARACTERISTICS
SYMBOL
PARAMETER
CONDITIONS
MIN.
TYP.
MAX.
UNIT
L
d
Internal drain inductance
Measured from contact screw on
-
3.5
-
nH
tab to centre of die
L
d
Internal drain inductance
Measured from drain lead 6 mm
-
4.5
-
nH
from package to centre of die
L
s
Internal source inductance
Measured from source lead 6 mm
-
7.5
-
nH
from package to source bond pad
1 During overload before short circuit load protection operates.
2 The reverse diode of this type is not intended for applications requiring fast reverse recovery.
January 1993
4
Rev 1.200
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