參數(shù)資料
型號： 440GP
廠商： Applied Micro Circuits Corp.
英文描述： Power PC 440GP Embedded Processor
中文描述： 440GP的Power PC嵌入式處理器
文件頁數(shù)： 53/83頁
文件大?。?/td> 773K
代理商： 440GP
440GP – Power PC 440GP Embedded Processor
AMCC
57
Revision 1.07 – October 4, 2007
Data Sheet
Heat Sink Mounting Information (Ceramic Package Only)
Proper thermal design is primarily dependent upon multiple system-level effects; that is, the effects of the heat
sink, the air flow, and the thermal interface material. To reduce the die-junction temperature, heat sinks may be
attached to the package by several methods: adhesive, spring clips to the printed-circuit board or package, or a
mounting clip and screw assembly. When attaching heat sinks, it is important to avoid placing excessive
mechanical stress on bonding of the chip to the substrate and the package to the board.
Heat Sink Attached With Spring Clip
Heat Sink Attached With Adhesive
Important: All of the guidelines indicated in the above diagrams must be evaluated and adjusted to account for the
shock and vibration effects of any particular application.
Heat sink
Thermal grease
Printed
circuit
board
CBGA
package
Heat sink
Heat sink clip
Printed
circuit
board
CBGA
package
Spring clip to board
Spring clip to package
Thermal grease
Heat sink clip
Static compression (spring force)—2.27kg maximum
Static compression (spring force)—2.27kg maximum1
Note 1: Force is limited by allowable compression on the die.
Allowable package compression force is 4.4kg.
Heat sink
Printed
circuit
board
CBGA
package
Adhesive
Heat sink
Printed
circuit
board
CBGA
package
Adhesive
Heat sink weight force—60g maximum
Weight
force
Weight
force
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相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
440GR 制造商:AMCC 制造商全稱:Applied Micro Circuits Corporation 功能描述:Power PC 440GR Embedded Processor
440GRX 制造商:AMCC 制造商全稱:Applied Micro Circuits Corporation 功能描述:PowerPC 440GRx Embedded Processor
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440GS001NF2535-4 功能描述:環(huán)形MIL規(guī)格后蓋 CRIMIP RING ADPTR DC STRAIGHT RoHS:否 制造商:Amphenol PCD MIL 類型:MIL-DTL-38999 III, IV 系列:AS85049 產(chǎn)品類型:Environmental EMI/RFI Backshells 外殼類型:Straight 外殼大小:18 外殼材質(zhì):Aluminum Alloy
440GS031B2912-4 制造商:Glenair Inc 功能描述:Shrink Boot Adapters 180° 29 Shell Size Olive Drab Cadmium Aluminum Direct 制造商:Glenair 功能描述:Shrink Boot Adapters 180° 29 Shell Size Olive Drab Cadmium Aluminum Direct
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