參數(shù)資料
型號： 16F871
廠商： Microchip Technology Inc.
英文描述： CAT 5E CROSSOVER PATCH CORD CABLE GREEN 6 FT
中文描述： 28/40-Pin 8位CMOS閃存微控制器
文件頁數(shù)： 144/156頁
文件大?。?/td> 2816K
代理商： 16F871
PIC16F870/871
DS30569A-page 144
Preliminary
1999 Microchip Technology Inc.
44-Lead Plastic Leaded Chip Carrier (L) – Square (PLCC)
CH2 x 45
°
CH1 x 45
°
10
5
0
10
5
0
β
Mold Draft Angle Bottom
*Controlling Parameter
Notes:
Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed
.010” (0.254mm) per side.
JEDEC Equivalent: MO-047
Drawing No. C04-048
10
5
0
10
5
0
α
Mold Draft Angle Top
0.53
0.51
0.33
.021
.020
.013
B
0.81
0.74
0.66
.032
.029
.026
B1
Upper Lead Width
Lower Lead Width
0.33
0.27
0.20
.013
.011
.008
c
Lead Thickness
11
11
n1
A
Pins per Side
Overall Height
16.00
15.75
14.99
.630
.620
.590
D2
Footprint Length
16.00
15.75
14.99
.630
.620
.590
E2
Footprint Width
16.66
16.59
16.51
.656
.653
.650
D1
Molded Package Length
16.66
16.59
16.51
.656
.653
.650
E1
Molded Package Width
17.65
17.53
17.40
.695
.690
.685
D
Overall Length
17.65
17.53
17.40
.695
.690
.685
E
Overall Width
0.25
0.13
0.00
.010
.005
.000
CH2
Corner Chamfer (others)
1.27
1.14
1.02
.050
.045
.040
CH1
Corner Chamfer 1
0.86
0.74
0.61
.034
.029
.024
A3
Side 1 Chamfer Height
0.51
.020
A1
Standoff
A2
Molded Package Thickness
4.57
4.06
0.89
4.39
3.87
0.71
4.19
3.68
.180
.160
.035
.173
.153
.028
.165
.145
1.27
.050
p
Pitch
44
44
n
Number of Pins
MAX
NOM
MIN
MAX
NOM
MIN
Dimension Limits
MILLIMETERS
INCHES*
Units
β
A2
c
E2
2
D
D1
n
#leads=n1
E
E1
1
α
p
A3
A
35
°
B1
B
D2
A1
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參數(shù)描述
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16F877 制造商:MICROCHIP 制造商全稱:Microchip Technology 功能描述:28/40-pin 8-Bit CMOS FLASH Microcontrollers
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