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參數(shù)資料
| 型號： | μPD72862 |
| 廠商： | NEC Corp. |
| 英文描述： | IEEE1394 OHCI Host Controller(IEEE1394 主控制器) |
| 中文描述： | IEEE1394連接OHCI主機控制器（IEEE1394連接主控制器） |
| 文件頁數(shù)： | 32/36頁 |
| 文件大?。?/td> | 194K |
| 代理商： | ΜPD72862 |
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Data Sheet S14265EJ2V0DS00
32
μ
PD72862
7. RECOMMENDED SOLDERING CONDITIONS
The
μ
PD72850A should be soldered and mounted under the following recommended conditions.
For the details of the recommended soldering conditions, refer to the document
Semiconductor Device Mounting
Technology Manual (C10535E)
.
For soldering methods and conditions other than those recommended below, contact your NEC sales
representative.
Table 7-1. Surface Mounting Type Soldering Conditions
μ
PD72862GC-9EU : 100-pin plastic TQFP (Fine pitch) (14 x 14)
Soldering
Method
Soldering Conditions
Recommended
Condition Symbol
Infrared reflow
Package peak temperature: 235°C, Time: 30 sec. Max. (at 210°C or higher).
Count: three times or less
Exposure limit: 3 days
Note
(after that prebake at 125°C for 10 hours)
IR35-103-3
VPS
Package peak temperature: 215°C, Time: 40 sec. Max. (at 200°C or higher).
Count: three times or less
Exposure limit: 3 days
Note
(after that prebake at 125°C for 10 hours)
VP15-103-3
Partial heating
Pin temperature: 300°C Max., Time: 3 sec. Max. (per pin row)
—
Note
After opening the dry pack, store it at 25°C or less and 65% RH or less for the allowable storage period.
Caution Do not use different soldering methods together (except for partial heating).
#
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