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參數(shù)資料
| 型號(hào)： | XPC8240LVV200E |
| 廠商： | Freescale Semiconductor |
| 文件頁數(shù)： | 35/52頁 |
| 文件大小： | 0K |
| 描述： | IC MPU INTEGRATED 200MHZ 352TBGA |
| 標(biāo)準(zhǔn)包裝： | 24 |
| 系列： | MPC82xx |
| 處理器類型： | 32-位 MPC82xx PowerQUICC II |
| 速度： | 200MHz |
| 電壓： | 2.5V |
| 安裝類型： | 表面貼裝 |
| 封裝/外殼： | 352-LBGA |
| 供應(yīng)商設(shè)備封裝： | 352-TBGA（35x35） |
| 包裝： | 托盤 |
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40
MPC8240 Integrated Processor Hardware Specifications
System Design Information
voltage, the MPC8240 always performs 3.3-V signaling as described in the PCI Local Bus Specification,
(Rev 2.1). The MPC8240 only tolerates 5-V signals when interfaced into a 5-V PCI bus system.
1.7.8
Thermal Management Information
This section provides thermal management information for the tape ball grid array (TBGA) package for
air-cooled applications. Proper thermal control design is primarily dependent on the system-level
design—the heat sink, airflow, and thermal interface material. To reduce the die-junction temperature, heat
sinks may be attached to the package by several methods: adhesive, spring clip to holes in the printed-circuit
board, or package and mounting clip and screw assembly. See Figure 26.
Figure 26. Package Exploded Cross-Sectional View with Several Heat Sink Options
Figure 27 depicts the die junction-to-ambient thermal resistance for four typical cases:
A heat sink is not attached to the TBGA package, and there exists high board-level thermal loading
of adjacent components.
A heat sink is not attached to the TBGA package, and there exists low board-level thermal loading
of adjacent components.
A heat sink (for example, ChipCoolers #HTS255-P) is attached to the TBGA package, and there
exists high board-level thermal loading of adjacent components.
A heat sink (for example, ChipCoolers #HTS255-P) is attached to the TBGA package, and there
exists low board-level thermal loading of adjacent components.
Adhesive or
Thermal Interface
Heat Sink
TBGA Package
Heat Sink
Clip
Printed-Circuit Board
Option
Material
Die
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Freescale Semiconductor, Inc.
For More Information On This Product,
Go to: www.freescale.com
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相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| XPC8240LZU200C | 制造商:Freescale Semiconductor 功能描述: |
| XPC8240LZU200E | 功能描述:微處理器 - MPU INTEGRATED HOST PROC RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時(shí)鐘頻率:536 MHz 程序存儲(chǔ)器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-324 |
| XPC8240RVV250 | 制造商:FREESCALE 制造商全稱:Freescale Semiconductor, Inc 功能描述:Modified voltage specifications to achieve 250 MHz |
| XPC8240RVV250E | 功能描述:微處理器 - MPU INTEGRATED HOST PROC RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時(shí)鐘頻率:536 MHz 程序存儲(chǔ)器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-324 |
| XPC8240RZU250 | 制造商:FREESCALE 制造商全稱:Freescale Semiconductor, Inc 功能描述:Modified voltage specifications to achieve 250 MHz |
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