參數(shù)資料
型號: W25X16AVDAIZ
廠商: WINBOND ELECTRONICS CORP
元件分類: PROM
英文描述: 2M X 8 FLASH 2.7V PROM, PDIP8
封裝: 0.300 INCH, ROHS COMPLIANT, PLASTIC, DIP-8
文件頁數(shù): 43/48頁
文件大?。?/td> 1493K
代理商: W25X16AVDAIZ
W25X16A
- 48 -
16 REVISION HISTORY
VERSION
DATE
PAGE
DESCRIPTION
A
07/09/08
All
New Create
Updated Max. Read Frequency to 100MHz
Updated Features section
Added SOIC-8 150mil package
Added G option for PDIP package
Trademarks
Winbond and SpiFlash are trademarks of Winbond Electronics Corporation.
All other marks are the property of their respective owner.
Important Notice
Winbond products are not designed, intended, authorized or warranted for use as components in
systems or equipment intended for surgical implantation, atomic energy control instruments, airplane
or spaceship instruments, transportation instruments, traffic signal instruments, combustion control
instruments, or for other applications intended to support or sustain life. Further more, Winbond
products are not intended for applications wherein failure of Winbond products could result or lead to a
situation wherein personal injury, death or severe property or environmental damage could occur.
Winbond customers using or selling these products for use in such applications do so at their own risk
and agree to fully indemnify Winbond for any damages resulting from such improper use or sales.
Information in this document is provided solely in connection with Winbond products. Winbond
reserves the right to make changes, corrections, modifications or improvements to this document and
the products and services decribed herein at any time, without notice.
相關(guān)PDF資料
PDF描述
W25X40AVSSIG 512K X 8 FLASH 2.7V PROM, PDSO8
W25X80AVDAIZ 1M X 8 FLASH 2.7V PROM, PDIP8
W25X80ALSSIG 1M X 8 FLASH 2.7V PROM, PDSO8
W25X40ALDAIZ 512K X 8 FLASH 2.7V PROM, PDIP8
W25X10ALSNIG 128K X 8 FLASH 2.7V PROM, PDSO8
相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
W25X16AVSFIG 功能描述:IC FLASH 16MBIT 75MHZ 16SOIC RoHS:是 類別:集成電路 (IC) >> 存儲器 系列:SpiFlash® 產(chǎn)品變化通告:Product Discontinuation 26/Apr/2010 標(biāo)準(zhǔn)包裝:136 系列:- 格式 - 存儲器:RAM 存儲器類型:SRAM - 同步,DDR II 存儲容量:18M(1M x 18) 速度:200MHz 接口:并聯(lián) 電源電壓:1.7 V ~ 1.9 V 工作溫度:0°C ~ 70°C 封裝/外殼:165-TBGA 供應(yīng)商設(shè)備封裝:165-CABGA(13x15) 包裝:托盤 其它名稱:71P71804S200BQ
W25X16AVSNIG 功能描述:IC FLASH 16MBIT 75MHZ 8SOIC RoHS:是 類別:集成電路 (IC) >> 存儲器 系列:SpiFlash® 產(chǎn)品變化通告:Product Discontinuation 26/Apr/2010 標(biāo)準(zhǔn)包裝:136 系列:- 格式 - 存儲器:RAM 存儲器類型:SRAM - 同步,DDR II 存儲容量:18M(1M x 18) 速度:200MHz 接口:并聯(lián) 電源電壓:1.7 V ~ 1.9 V 工作溫度:0°C ~ 70°C 封裝/外殼:165-TBGA 供應(yīng)商設(shè)備封裝:165-CABGA(13x15) 包裝:托盤 其它名稱:71P71804S200BQ
W25X16AVSSIG 功能描述:IC FLASH 16MBIT 75MHZ 8SOIC RoHS:是 類別:集成電路 (IC) >> 存儲器 系列:SpiFlash® 產(chǎn)品變化通告:Product Discontinuation 26/Apr/2010 標(biāo)準(zhǔn)包裝:136 系列:- 格式 - 存儲器:RAM 存儲器類型:SRAM - 同步,DDR II 存儲容量:18M(1M x 18) 速度:200MHz 接口:并聯(lián) 電源電壓:1.7 V ~ 1.9 V 工作溫度:0°C ~ 70°C 封裝/外殼:165-TBGA 供應(yīng)商設(shè)備封裝:165-CABGA(13x15) 包裝:托盤 其它名稱:71P71804S200BQ
W25X16AVZPIG 制造商:WINBOND 制造商全稱:Winbond 功能描述:16M-BIT, 32M-BIT, AND 64M-BIT SERIAL FLASH MEMORY WITH 4KB SECTORS AND DUAL OUTPUT SPI
W25X16BV 制造商:WINBOND 制造商全稱:Winbond 功能描述:16M-BIT SERIAL FLASH MEMORY WITH 4KB SECTORS AND DUAL OUTPUT SPI