參數(shù)資料
型號(hào)： TZA1038HW,118
廠商： NXP Semiconductors
文件頁(yè)數(shù)： 38/45頁(yè)
文件大?。?/td> 0K
描述： IC DVD SIGNAL PROC 48-HTQFP
標(biāo)準(zhǔn)包裝： 2,500
系列： *
類型： *
應(yīng)用： *
安裝類型： 表面貼裝
封裝/外殼： 48-TQFP 裸露焊盤
供應(yīng)商設(shè)備封裝： 48-HTQFP
包裝： 帶卷 (TR)
其它名稱： 935273843118
TZA1038HW-T
TZA1038HW-T-ND
2003 Sep 03
43
Philips Semiconductors
Product specication
High speed advanced analog DVD signal
processor and laser supply
TZA1038HW
13.5
Suitability of surface mount IC packages for wave and reow soldering methods
Notes
1. For more detailed information on the BGA packages refer to the
“(LF)BGA Application Note” (AN01026); order a copy
from your Philips Semiconductors sales office.
2. All surface mount (SMD) packages are moisture sensitive. Depending upon the moisture content, the maximum
temperature (with respect to time) and body size of the package, there is a risk that internal or external package
cracks may occur due to vaporization of the moisture in them (the so called popcorn effect). For details, refer to the
Drypack information in the
“Data Handbook IC26; Integrated Circuit Packages; Section: Packing Methods”.
3. These transparent plastic packages are extremely sensitive to reflow soldering conditions and must on no account
be processed through more than one soldering cycle or subjected to infrared reflow soldering with peak temperature
exceeding 217
°C ± 10 °C measured in the atmosphere of the reflow oven. The package body peak temperature
must be kept as low as possible.
4. These packages are not suitable for wave soldering. On versions with the heatsink on the bottom side, the solder
cannot penetrate between the printed-circuit board and the heatsink. On versions with the heatsink on the top side,
the solder might be deposited on the heatsink surface.
5. If wave soldering is considered, then the package must be placed at a 45
° angle to the solder wave direction.
The package footprint must incorporate solder thieves downstream and at the side corners.
6. Wave soldering is suitable for LQFP, TQFP and QFP packages with a pitch (e) larger than 0.8 mm; it is definitely not
suitable for packages with a pitch (e) equal to or smaller than 0.65 mm.
7. Wave soldering is suitable for SSOP, TSSOP, VSO and VSSOP packages with a pitch (e) equal to or larger than
0.65 mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm.
8. Hot bar or manual soldering is suitable for PMFP packages.
PACKAGE(1)
SOLDERING METHOD
WAVE
REFLOW(2)
BGA, LBGA, LFBGA, SQFP, SSOP-T(3), TFBGA, VFBGA
not suitable
suitable
DHVQFN, HBCC, HBGA, HLQFP, HSQFP, HSOP, HTQFP,
HTSSOP, HVQFN, HVSON, SMS
not suitable(4)
suitable
PLCC(5), SO, SOJ
suitable
LQFP, QFP, TQFP
not recommended(5)(6)
suitable
SSOP, TSSOP, VSO, VSSOP
not recommended(7)
suitable
PMFP(8)
not suitable
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