
2003 Sep 03
2
Philips Semiconductors
Product specication
High speed advanced analog DVD signal
processor and laser supply
TZA1038HW
CONTENTS
1
FEATURES
2
GENERAL DESCRIPTION
3
ORDERING INFORMATION
4
QUICK REFERENCE DATA
5
BLOCK DIAGRAM
6
PINNING
7
FUNCTIONAL DESCRIPTION
7.1
RF data processing
7.2
Servo signal processing
7.2.1
Servo signal path set-up
7.2.2
Focus servo
7.2.3
Radial servo
7.2.4
Differential phase detection
7.2.4.1
Drop-out concealment
7.2.4.2
Push-pull and three-beam push-pull
7.2.4.3
Enhanced push-pull (dynamic offset
compensation for beam landing)
7.2.4.4
Offset compensation
7.2.5
Automatic dual laser supply
7.2.6
Power-on reset and general power on
7.2.7
Compatibility with TZA1033HL/V1
7.2.7.1
Software compatibility
7.2.7.2
Hardware compatibility
7.2.8
Interface to the system controller
7.3
Control registers
7.3.1
Register 0: power control
7.3.2
Register 1: servo and RF modes
7.3.3
Register 2: focus offset DAC
7.3.4
Register 3: RF path gain
7.3.5
Register 4: RF left and right, or sum offset
compensation
7.3.6
Register 5: RF sum offset compensation
7.3.7
Register 6: servo gain and dynamic radial
offset compensation factor
7.3.8
Register 7: servo path gain and bandwidth and
RF path bandwidth and pre-emphasis
7.3.9
Register 8: RF channel selection
7.3.10
Register 11: radial servo offset cancellation
7.3.11
Register 12: central servo offset cancellation
inputs A and B
7.3.12
Register 13: central servo offset cancellation
inputs C and D
7.3.13
Register 14: RF filter settings
7.3.14
Register 15: DPD filter settings
7.4
Internal digital control, serial bus and external
digital input signal relationships
7.4.1
STANDBY mode
7.4.2
RF only mode
7.5
Signal descriptions
7.5.1
Data path signals through pins A to D
7.5.2
Data signal path through input pins RFSUMP
and RFSUMN
7.5.3
HF filtering
7.5.4
Focus signals
7.5.5
Radial signals
7.5.5.1
DPD signals (DVD-ROM mode) with no
drop-out concealment
7.5.5.2
DPD signals (DVD-ROM mode) with
drop-out concealment
7.5.5.3
Three-beam push-pull (CD mode)
7.5.5.4
Enhanced push-pull
8
LIMITING VALUES
9
THERMAL CHARACTERISTICS
10
CHARACTERISTICS
11
APPLICATION INFORMATION
11.1
Signal relationships
11.1.1
Data path
11.1.2
Servo path
11.2
Programming examples
11.3
Energy saving
11.4
Initial DC and gain setting strategy
11.4.1
Electrical offset from pick-up
11.4.2
Gain setting servo
11.4.3
DC level in RF path
11.4.4
Gain setting RF path
12
PACKAGE OUTLINE
13
SOLDERING
13.1
Introduction to soldering surface mount
packages
13.2
Reflow soldering
13.3
Wave soldering
13.4
Manual soldering
13.5
Suitability of surface mount IC packages for
wave and reflow soldering methods
14
DATA SHEET STATUS
15
DEFINITIONS
16
DISCLAIMERS