參數(shù)資料
型號(hào)： TTRN0110G
英文描述： ATM MULTIPLEXER|BGA|198PIN|CERAMIC
中文描述： ATM多路復(fù)用器|的BGA | 198PIN |陶瓷
文件頁(yè)數(shù)： 28/30頁(yè)
文件大小： 578K
代理商： TTRN0110G
28
Agere Systems Inc.
Data Sheet
March 29, 2002
10 Gbits/s Clock Synthesizer, 16:1 Data Multiplexer
TTRN0110G
Packaging Characteristics
(continued)
Assembly Information
Note:
Each assembly process will have its own idiosyncrasies, due to product design, material differences, and
equipment variations. Assembly information provided here is a beginning point from which the assembly
process engineer should apply their knowledge and experience to obtain optimal results.
It is recommended that the stencil thickness be set at 0.006 in. for a starting point. After trials with the recom-
mended stencil opening size, stencil thickness, and process specific solder paste, a visual inspection should be
done to assure a proper fillet and wetting is obtained for each ball. The reflowed solder fillet should resemble a
cylindrical column from the PWB to the center of the ball.
The reflow profile should be determined using a known set point for the oven such as the Joint Electron Device
Engineering Council (JEDEC) profile. The JEDEC profile is defined as the following parameters:
Table 23. JEDEC Profile
Belt speed = 28 in./min.
A representative sample of the product (fitted with multiple thermocouples and a data logger) should be run
through the oven to determine the optimum profile. The temperature of the CBGA device should not exceed
225 °C, and only be above the liquidus of the solder alloy (typically 180 °C) for less than 60 s.
Reference Materials
For further information, the user may wish to consult some of the many references that are available on the
technical market today for CBGA assembly. The following are suggested for more detailed information, but there
are many others too:
I
Ceramic Ball Grid Array Surface Mount Assembly and Rework
, IBM Document #APD-SBSC-101.0, Cindy
Milkovich, Lisa Jimarez, IBM Corporation, 1701 North Street, Endicott, NY 13760, (800) 925-3157
I
Ball Grid Array Technology
, John Lau (Editor), ISBN 0-07-036608-X, McGraw-Hill, Inc., 1221 Avenue of the
Americas, New York, NY 10020
Zone
Temp
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205
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1
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