參數資料
型號: TPS65020RHA
廠商: Texas Instruments, Inc.
英文描述: POWER MANAGEMENT IC FOR LI-ION POWERED SYSTEMS
中文描述: 電源管理IC鋰離子供電系統
文件頁數: 2/44頁
文件大?。?/td> 3085K
代理商: TPS65020RHA
www.ti.com
ABSOLUTE MAXIMUM RATINGS
(1)
over operating free-air temperature range (unless otherwise noted)
DISSIPATION RATINGS
RECOMMENDED OPERATING CONDITIONS
over operating free-air temperature range (unless otherwise noted)
TPS65020
SLVS607–SEPTEMBER 2005
These devices have limited built-in ESD protection. The leads should be shorted together or the device
placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates.
ORDERING INFORMATION
T
A
PACKAGE
40 pin QFN (RHA)
PART NUMBER
(1)
TPS65020RHA
–40
°
C to 85
°
C
(1)
The RHA package is available in tape and reel. Add the R suffix (TPS65020RHAR) to order quantities of 2500 parts per reel. Add the T
suffix (TPS65020RHAT) to order quantities of 250 parts per reel.
VALUE
–0.3 to 7
2000
1000
UNIT
V
mA
mA
V
I
Input voltage range on all pins except AGND and PGND pins with respect to AGND
Current at VINDCDC1, L1, PGND1, VINDCDC2, L2, PGND2, VINDCDC3, L3, PGND3
Peak Current at all other pins
Continuous total power dissipation
Operating free-air temperature
Maximum junction temperature
Storage temperature
Lead temperature 1,6 mm (1/16-inch) from case for 10 seconds
See Dissipation Rating Table
–40 to 85
125
–65 to 150
260
T
A
T
J
T
stg
°
C
°
C
°
C
°
C
(1)
Stresses beyond those listed under
absolute maximum ratings
may cause permanent damage to the device. These are stress ratings
only and functional operation of the device at these or any other conditions beyond those indicated under
recommended operating
conditions
is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability
T
25
°
C
POWER RATING
2.85 W
DERATING FACTOR
ABOVE T
A
= 25°C
28 mW/
°
C
T
= 70
°
C
POWER RATING
1.57 W
T
= 85
°
C
POWER RATING
1.4 W
PACKAGE
RHA
(1)(2)
(1)
(2)
The thermal resistance junction to ambient of the RHA package is 32
°
C/W measured on a high K board.
The thermal resistance junction to case (exposed pad) of the RHA package is 5
°
C/W
MIN
NOM
MAX
UNIT
Input voltage range step-down convertors
(VINDCDC1, VINDCDC2, VINDCDC3)
Output voltage range for VDCDC1 step-down convertor
(1)
Output voltage range for VDCDC2 step-down convertor
(1)
Output voltage range for VDCDC3 (core) step-down convertor
(1)
Input voltage range for LDOs (VINLDO1, VINLDO2)
Output voltage range for LDOs (VLDO1, VLDO2)
Output current at L1
Inductor at L1
(2)
Input Capacitor at V
I(DCDC1)(2)
Output Capacitor at VDCDC1
(2)
Output current at L2
Inductor at L2
(2)
V
CC
2.5
6
V
0.6
0.6
0.6
1.5
VINDCDC1
VINDCDC2
VINDCDC3
V
O
V
V
I
V
O
I
O(DCDC1)
6.5
V
V
1
VINLDO1-2
1200
mA
μ
H
μ
F
μ
F
mA
μ
H
2.2
10
10
3.3
C
I(DCDC1)
C
O(DCDC1)
I
O(DCDC2)
22
1000
2.2
3.3
(1)
(2)
When using an external resistor divider at DEFDCDC3, DEFDCDC2, DEFDCDC1
See applications section for more information.
2
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