參數(shù)資料
型號(hào)： TG80960JA-25
廠商： INTEL CORP
元件分類(lèi)： 微控制器/微處理器
英文描述： EMBEDDED 32-BIT MICROPROCESSOR
中文描述： 32-BIT, 25 MHz, RISC PROCESSOR, PQFP132
封裝： PLASTIC, QFP-132
文件頁(yè)數(shù)： 4/78頁(yè)
文件大小： 835K
代理商： TG80960JA-25
80960JA/JF/JD/JT 3.3 V Microprocessor
4
Advance Information
Datasheet
Figures
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80960Jx Microprocessor Package Options...........................................................7
80960Jx Block Diagram ........................................................................................9
132-Lead Pin Grid Array Bottom View - Pins Facing Up.....................................22
132-Lead Pin Grid Array Top View - Pins Facing Down .....................................23
132-Lead PQFP - Top View................................................................................26
196-Ball Mini Plastic Ball Grid Array Bottom View - Balls Facing Up..................29
196-Ball Mini Plastic Ball Grid Array Top View - Balls Facing Down ..................30
VCC5 Current-Limiting Resistor..........................................................................40
VCCPLL Lowpass Filter......................................................................................41
AC Test Load ......................................................................................................47
Output Delay or Hold vs. Load Capacitance.......................................................48
T
LX
vs. AD Bus Load Capacitance......................................................................48
80960JA/JF I
CC
Active (Power Supply) vs. Frequency.......................................49
80960JA/JF I
CC
Active (Thermal) vs. Frequency................................................49
80960JD I
CC
Active (Power Supply) vs. Frequency............................................50
80960JD I
CC
Active (Thermal) vs. Frequency.....................................................50
80960JT I
CC
Active (Power Supply) vs. Frequency...........................................51
80960JT I
CC
Active (Thermal) vs. Frequency.....................................................51
CLKIN Waveform ................................................................................................52
T
OV1
Output Delay Waveform.............................................................................52
T
OF
Output Float Waveform................................................................................53
T
IS1
and T
IH1
Input Setup and Hold Waveform...................................................53
T
IS2
and T
IH2
Input Setup and Hold Waveform...................................................53
T
IS3
and T
IH3
Input Setup and Hold Waveform...................................................54
T
IS4
and T
IH4
Input Setup and Hold Waveform...................................................54
T
LX
, T
LXL
and T
LXA
Relative Timings Waveform.................................................55
DT/R and DEN Timings Waveform .....................................................................55
TCK Waveform....................................................................................................56
T
BSIS1
and T
BSIH1
Input Setup and Hold Waveforms .........................................56
T
BSOV1
and T
BSOF1
Output Delay and Output Float Waveform..........................56
T
BSOV2
and T
BSOF2
Output Delay and Output Float Waveform..........................57
T
BSIS2
and T
BSIH2
Input Setup and Hold Waveform...........................................57
Non-Burst Read and Write Transactions Without Wait States, 32-Bit Bus .........58
Burst Read and Write Transactions Without Wait States, 32-Bit Bus.................59
Burst Write Transactions With 2,1,1,1 Wait States, 32-Bit Bus...........................60
Burst Read and Write Transactions Without Wait States, 8-Bit Bus...................61
Burst Read and Write Transactions With 1, 0 Wait States and
Extra Tr State on Read, 16-Bit Bus.....................................................................62
Double Word Read Bus Request, Misaligned One Byte From
Quad Word Boundary, 32-Bit Bus, Little Endian.................................................63
HOLD/HOLDA Waveform For Bus Arbitration ....................................................64
Cold Reset Waveform.........................................................................................65
Warm Reset Waveform.......................................................................................66
Entering the ONCE State....................................................................................67
Bus States with Arbitration..................................................................................68
Summary of Aligned and Unaligned Accesses (32-Bit Bus) ...............................72
Summary of Aligned and Unaligned Accesses (32-Bit Bus) (Continued) ...........73
80960JT Device Identification Register...............................................................74
80960JD Device Identification Register ..............................................................75
80960JA/JF Device Identification Register .........................................................76
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相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
TG80960JA3V25 功能描述:IC MPU I960JA 3V 25MHZ 132-QFP RoHS:否 類(lèi)別:集成電路 (IC) >> 嵌入式 - 微處理器 系列:- 標(biāo)準(zhǔn)包裝:40 系列:MPC83xx 處理器類(lèi)型:32-位 MPC83xx PowerQUICC II Pro 特點(diǎn):- 速度:267MHz 電壓:0.95 V ~ 1.05 V 安裝類(lèi)型:表面貼裝 封裝/外殼:516-BBGA 裸露焊盤(pán) 供應(yīng)商設(shè)備封裝:516-PBGAPGE（27x27） 包裝:托盤(pán)
TG80960JC66 功能描述:IC MPU I960JC 66MHZ 132-PQFP RoHS:否 類(lèi)別:集成電路 (IC) >> 嵌入式 - 微處理器 系列:- 標(biāo)準(zhǔn)包裝:60 系列:SCC 處理器類(lèi)型:Z380 特點(diǎn):全靜電 Z380 CPU 速度:20MHz 電壓:5V 安裝類(lèi)型:表面貼裝 封裝/外殼:144-LQFP 供應(yīng)商設(shè)備封裝:144-LQFP 包裝:托盤(pán)
TG80960JS25 功能描述:IC MPU I960JS 3V 25MHZ 132-QFP RoHS:否 類(lèi)別:集成電路 (IC) >> 嵌入式 - 微處理器 系列:- 標(biāo)準(zhǔn)包裝:60 系列:SCC 處理器類(lèi)型:Z380 特點(diǎn):全靜電 Z380 CPU 速度:20MHz 電壓:5V 安裝類(lèi)型:表面貼裝 封裝/外殼:144-LQFP 供應(yīng)商設(shè)備封裝:144-LQFP 包裝:托盤(pán)
TG80960JS33 功能描述:IC MPU I960JS 3V 33MHZ 132-QFP RoHS:否 類(lèi)別:集成電路 (IC) >> 嵌入式 - 微處理器 系列:- 標(biāo)準(zhǔn)包裝:40 系列:MPC83xx 處理器類(lèi)型:32-位 MPC83xx PowerQUICC II Pro 特點(diǎn):- 速度:267MHz 電壓:0.95 V ~ 1.05 V 安裝類(lèi)型:表面貼裝 封裝/外殼:516-BBGA 裸露焊盤(pán) 供應(yīng)商設(shè)備封裝:516-PBGAPGE（27x27） 包裝:托盤(pán)
TG80960JT100 功能描述:IC MPU I960JT 3V 100MHZ 132-QFP RoHS:否 類(lèi)別:集成電路 (IC) >> 嵌入式 - 微處理器 系列:- 標(biāo)準(zhǔn)包裝:2 系列:MPC8xx 處理器類(lèi)型:32-位 MPC8xx PowerQUICC 特點(diǎn):- 速度:133MHz 電壓:3.3V 安裝類(lèi)型:表面貼裝 封裝/外殼:357-BBGA 供應(yīng)商設(shè)備封裝:357-PBGA（25x25） 包裝:托盤(pán)
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