參數(shù)資料
型號(hào): TG80960JA-25
廠商: INTEL CORP
元件分類: 微控制器/微處理器
英文描述: EMBEDDED 32-BIT MICROPROCESSOR
中文描述: 32-BIT, 25 MHz, RISC PROCESSOR, PQFP132
封裝: PLASTIC, QFP-132
文件頁數(shù): 34/78頁
文件大?。?/td> 835K
代理商: TG80960JA-25
80960JA/JF/JD/JT 3.3 V Microprocessor
34
Advance Information Datasheet
3.2
Package Thermal Specifications
The 80960Jx is specified for operation when T
C
(case temperature) is within the range of
0°C to
100°C for PGA, MPBGA and PQFP packages. An extended temperature device is also available in
a PQFP package with T
C
-40°C to 100°C. Case temperature may be measured in any environment
to determine whether the 80960Jx is within its specified operating range. The case temperature
should be measured at the center of the top surface, opposite the pins.
θ
CA
is the thermal resistance from case to ambient. Use the following equation to calculate T
A
, the
maximum ambient temperature to conform to a particular case temperature:
T
A
= T
C
- P (
θ
CA
)
Junction temperature (T
J
) is commonly used in reliability calculations. T
J
can be calculated from
θ
JC
(thermal resistance from junction to case) using the following equation:
T
J
= T
C
+ P (
θ
JC
)
Similarly, if T
A
is known, the corresponding case temperature (T
C
) can be calculated as follows:
T
C
= T
A
+ P (
θ
CA
)
Compute P by multiplying I
CC
from Table 22 and V
CC
. Values for
θ
JC
and
θ
CA
are given in
Table 12 for the PGA package, Table 13 for the MPBGA package, and Table 14 for the PQFP
package. For high speed operation, the processor’s
θ
JA
may be significantly reduced by adding a
heatsink and/or by increasing airflow.
Tables 15, 16, and 17 show the maximum ambient temperature (T
A
) permitted without exceeding
T
C
for the PGA, MPBGA, and PQFP packages. The values are based on typical I
CC
and V
CC
of
+3.3 V, with a T
CASE
of +100°C.
L13
NC
M10
XINT2
N7
TDO
P4
V
CC
L14
RDYRCV
M11
XINT0
N8
NC
P5
WIDTH0
M1
DT/R
M12
TMS
N9
XINT4
P6
WIDTH1
M2
V
CC
M13
TRST
N10
NC
P7
FAIL
M3
NC
M14
TCK
N11
XINT6
P8
NC
M4
NC
N1
W/R
N12
XINT1
P9
NC
M5
A3
N2
D/C
N13
XINT3
P10
NMI
M6
V
CC
N3
NC
N14
HOLD
P11
XINT7
M7
ALE
N4
NC
P1
NC
P12
XINT5
M8
VCC5
N5
A2
P2
ADS
P13
V
CC
M9
V
CC
N6
V
CC
P3
BLAST
P14
NC
Table 11.
196-Ball MPBGA Pinout — In Pin Order (Sheet 2 of 2)
Pin
Signal
Pin
Signal
Pin
Signal
Pin
Signal
NOTE:
Do not connect any external logic to pins marked NC (no connect pins).
相關(guān)PDF資料
PDF描述
TGS2450 TGS2450
TGS821 SPECIAL SENSOR FOR HYDROGEN GAS
TH10 Thermal Cut-out
TH63 CONTAORE MINIATURIZZATO
TH64 MINIATURE POWER RELAY
相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
TG80960JA3V25 功能描述:IC MPU I960JA 3V 25MHZ 132-QFP RoHS:否 類別:集成電路 (IC) >> 嵌入式 - 微處理器 系列:- 標(biāo)準(zhǔn)包裝:40 系列:MPC83xx 處理器類型:32-位 MPC83xx PowerQUICC II Pro 特點(diǎn):- 速度:267MHz 電壓:0.95 V ~ 1.05 V 安裝類型:表面貼裝 封裝/外殼:516-BBGA 裸露焊盤 供應(yīng)商設(shè)備封裝:516-PBGAPGE(27x27) 包裝:托盤
TG80960JC66 功能描述:IC MPU I960JC 66MHZ 132-PQFP RoHS:否 類別:集成電路 (IC) >> 嵌入式 - 微處理器 系列:- 標(biāo)準(zhǔn)包裝:60 系列:SCC 處理器類型:Z380 特點(diǎn):全靜電 Z380 CPU 速度:20MHz 電壓:5V 安裝類型:表面貼裝 封裝/外殼:144-LQFP 供應(yīng)商設(shè)備封裝:144-LQFP 包裝:托盤
TG80960JS25 功能描述:IC MPU I960JS 3V 25MHZ 132-QFP RoHS:否 類別:集成電路 (IC) >> 嵌入式 - 微處理器 系列:- 標(biāo)準(zhǔn)包裝:60 系列:SCC 處理器類型:Z380 特點(diǎn):全靜電 Z380 CPU 速度:20MHz 電壓:5V 安裝類型:表面貼裝 封裝/外殼:144-LQFP 供應(yīng)商設(shè)備封裝:144-LQFP 包裝:托盤
TG80960JS33 功能描述:IC MPU I960JS 3V 33MHZ 132-QFP RoHS:否 類別:集成電路 (IC) >> 嵌入式 - 微處理器 系列:- 標(biāo)準(zhǔn)包裝:40 系列:MPC83xx 處理器類型:32-位 MPC83xx PowerQUICC II Pro 特點(diǎn):- 速度:267MHz 電壓:0.95 V ~ 1.05 V 安裝類型:表面貼裝 封裝/外殼:516-BBGA 裸露焊盤 供應(yīng)商設(shè)備封裝:516-PBGAPGE(27x27) 包裝:托盤
TG80960JT100 功能描述:IC MPU I960JT 3V 100MHZ 132-QFP RoHS:否 類別:集成電路 (IC) >> 嵌入式 - 微處理器 系列:- 標(biāo)準(zhǔn)包裝:2 系列:MPC8xx 處理器類型:32-位 MPC8xx PowerQUICC 特點(diǎn):- 速度:133MHz 電壓:3.3V 安裝類型:表面貼裝 封裝/外殼:357-BBGA 供應(yīng)商設(shè)備封裝:357-PBGA(25x25) 包裝:托盤