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參數資料
| 型號： | TFP503PZP |
| 廠商： | Texas Instruments, Inc. |
| 英文描述： | PANELBUS HDCP DIGITAL RECEIVER |
| 中文描述： | PANELBUS支持HDCP數字接收機 |
| 文件頁數： | 22/27頁 |
| 文件大?。?/td> | 445K |
| 代理商： | TFP503PZP |
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SLDS149 AUGUST 2004
22
POST OFFICE BOX 655303
DALLAS, TEXAS 75265
Thermal Vias
5.8 mm SQ
Minimum
Figure 21. Recommended Thermal Land Size
More information on this package and other requirements for using thermal lands and thermal vias are detailed
in the TI application note
PowerPAD Thermally Enhanced Package Application Report
, TI literature number
SLMA002, available via the TI Web pages beginning at URL: http://www.ti.com
The following table outlines the thermal properties of the TI 100-terminal TQFP PowerPAD package.
Table 1. TI 100-Terminal TQFP (14
×
14
×
1 mm)/0.5-mm Lead Pitch
PARAMETER
PowerPAD
NOT CONNECTED TO
PCB THERMAL PLANE
PowerPAD
CONNECTED TO PCB
THERMAL PLANE
(see Note 15)
22.5
°
C/W
3.55 W
R
θ
JA
PD
NOTES: 15. Specified with the PowerPAD bond pad on the backside of the package soldered to a 2 oz Cu plate PCB thermal plane.
16. Airflow is at 0 LFM (no airflow).
17. Specified at 150
°
C junction temperature and 70
°
C ambient temperature.
18. It is recommended that the power pad of the device must be connected to the PCB thermal plane for improved thermal performance.
Junction-to-ambient thermal resistance (see Notes 15, 16, 17, and 18)
73.7
°
C/W
1.08 W
Package power dissipation (see Notes 15, 16, 17, and 18)
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