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參數(shù)資料
| 型號： | TDA8932TW |
| 廠商： | NXP SEMICONDUCTORS |
| 元件分類： | 音頻／視頻放大 |
| 英文描述： | 25 W, 1 CHANNEL, AUDIO AMPLIFIER, PDSO32 |
| 封裝： | 6.10 MM, 0.65 MM PITCH, PLASTIC, MO-153, SOT549-1, HTSSOP-32 |
| 文件頁數(shù)： | 38/45頁 |
| 文件大?。?/td> | 285K |
| 代理商： | TDA8932TW |
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TDA8932_1
Koninklijke Philips Electronics N.V. 2006. All rights reserved.
Preliminary data sheet
Rev. 01 — 11 May 2006
43 of 45
Philips Semiconductors
TDA8932
Class-D audio amplier
[4]
These packages are not suitable for wave soldering. On versions with the heatsink on the bottom side, the
solder cannot penetrate between the printed-circuit board and the heatsink. On versions with the heatsink
on the top side, the solder might be deposited on the heatsink surface.
[5]
If wave soldering is considered, then the package must be placed at a 45
° angle to the solder wave
direction. The package footprint must incorporate solder thieves downstream and at the side corners.
[6]
Wave soldering is suitable for LQFP, QFP and TQFP packages with a pitch (e) larger than 0.8 mm; it is
denitely not suitable for packages with a pitch (e) equal to or smaller than 0.65 mm.
[7]
Wave soldering is suitable for SSOP, TSSOP, VSO and VSSOP packages with a pitch (e) equal to or larger
than 0.65 mm; it is denitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm.
[8]
Image sensor packages in principle should not be soldered. They are mounted in sockets or delivered
pre-mounted on ex foil. However, the image sensor package can be mounted by the client on a ex foil by
using a hot bar soldering process. The appropriate soldering prole can be provided on request.
[9]
Hot bar soldering or manual soldering is suitable for PMFP packages.
18. Abbreviations
19. Revision history
Table 17.
Abbreviations
Acronym
Description
BTL
Bridge Tied Load
DMOS
Double diffused Metal Oxide Semiconductor
ESD
ElectroStatic Discharge
PWM
Pulse Width Modulation
OCP
OverCurrent Protection
OTP
OverTemperature Protection
OVP
OverVoltage Protection
UBP
UnBalance Protection
UVP
UnderVoltage Protection
TF
Thermal Foldback
WP
Window Protection
Table 18.
Revision history
Document ID
Release date
Data sheet status
Change notice
Supersedes
TDA8932_1
20060511
Preliminary data sheet
-
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| TDA8944AJ | 7 W, 2 CHANNEL, AUDIO AMPLIFIER, PZIP17 |
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相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| TDA8933 | 制造商:PHILIPS 制造商全稱:NXP Semiconductors 功能描述:Class-D audio amplifier |
| TDA8933B | 制造商:PHILIPS 制造商全稱:NXP Semiconductors 功能描述:Class D audio amplifier |
| TDA8933BTW | 制造商:PHILIPS 制造商全稱:NXP Semiconductors 功能描述:Class D audio amplifier |
| TDA8933BTW/N2,112 | 功能描述:音頻放大器 Class D audio amplifier 32 leads RoHS:否 制造商:STMicroelectronics 產(chǎn)品:General Purpose Audio Amplifiers 輸出類型:Digital 輸出功率: THD + 噪聲: 工作電源電壓:3.3 V 電源電流: 最大功率耗散: 最大工作溫度: 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:TQFP-64 封裝:Reel |
| TDA8933BTW/N2,118 | 功能描述:音頻放大器 Class D audio amplifier 32 leads RoHS:否 制造商:STMicroelectronics 產(chǎn)品:General Purpose Audio Amplifiers 輸出類型:Digital 輸出功率: THD + 噪聲: 工作電源電壓:3.3 V 電源電流: 最大功率耗散: 最大工作溫度: 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:TQFP-64 封裝:Reel |
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