參數資料
型號： TDA8932TW
廠商： NXP SEMICONDUCTORS
元件分類： 音頻／視頻放大
英文描述： 25 W, 1 CHANNEL, AUDIO AMPLIFIER, PDSO32
封裝： 6.10 MM, 0.65 MM PITCH, PLASTIC, MO-153, SOT549-1, HTSSOP-32
文件頁數： 36/45頁
文件大小： 285K
代理商： TDA8932TW
TDA8932_1
Koninklijke Philips Electronics N.V. 2006. All rights reserved.
Preliminary data sheet
Rev. 01 — 11 May 2006
41 of 45
Philips Semiconductors
TDA8932
Class-D audio amplier
17. Soldering
17.1 Introduction to soldering surface mount packages
This text gives a very brief insight to a complex technology. A more in-depth account of
soldering ICs can be found in our
Data Handbook IC26; Integrated Circuit Packages
(document order number 9398 652 90011).
There is no soldering method that is ideal for all surface mount IC packages. Wave
soldering can still be used for certain surface mount ICs, but it is not suitable for ne pitch
SMDs. In these situations reow soldering is recommended.
17.2 Reow soldering
Reow soldering requires solder paste (a suspension of ne solder particles, ux and
binding agent) to be applied to the printed-circuit board by screen printing, stencilling or
pressure-syringe dispensing before package placement. Driven by legislation and
environmental forces the worldwide use of lead-free solder pastes is increasing.
Several methods exist for reowing; for example, convection or convection/infrared
heating in a conveyor type oven. Throughput times (preheating, soldering and cooling)
vary between 100 seconds and 200 seconds depending on heating method.
Typical reow peak temperatures range from 215
°Cto260 °C depending on solder paste
material. The top-surface temperature of the packages should preferably be kept:
below 225
°C (SnPb process) or below 245 °C (Pb-free process)
– for all BGA, HTSSON..T and SSOP..T packages
– for packages with a thickness
≥ 2.5 mm
– for packages with a thickness < 2.5 mm and a volume
≥ 350 mm3 so called
thick/large packages.
below 240
°C (SnPb process) or below 260 °C (Pb-free process) for packages with a
thickness < 2.5 mm and a volume < 350 mm3 so called small/thin packages.
Moisture sensitivity precautions, as indicated on packing, must be respected at all times.
17.3 Wave soldering
Conventional single wave soldering is not recommended for surface mount devices
(SMDs) or printed-circuit boards with a high component density, as solder bridging and
non-wetting can present major problems.
To overcome these problems the double-wave soldering method was specically
developed.
If wave soldering is used the following conditions must be observed for optimal results:
Use a double-wave soldering method comprising a turbulent wave with high upward
pressure followed by a smooth laminar wave.
For packages with leads on two sides and a pitch (e):
– larger than or equal to 1.27 mm, the footprint longitudinal axis is preferred to be
parallel to the transport direction of the printed-circuit board;
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相關代理商/技術參數
參數描述
TDA8933 制造商:PHILIPS 制造商全稱:NXP Semiconductors 功能描述:Class-D audio amplifier
TDA8933B 制造商:PHILIPS 制造商全稱:NXP Semiconductors 功能描述:Class D audio amplifier
TDA8933BTW 制造商:PHILIPS 制造商全稱:NXP Semiconductors 功能描述:Class D audio amplifier
TDA8933BTW/N2,112 功能描述:音頻放大器 Class D audio amplifier 32 leads RoHS:否 制造商:STMicroelectronics 產品:General Purpose Audio Amplifiers 輸出類型:Digital 輸出功率: THD + 噪聲: 工作電源電壓:3.3 V 電源電流: 最大功率耗散: 最大工作溫度: 安裝風格:SMD/SMT 封裝 / 箱體:TQFP-64 封裝:Reel
TDA8933BTW/N2,118 功能描述:音頻放大器 Class D audio amplifier 32 leads RoHS:否 制造商:STMicroelectronics 產品:General Purpose Audio Amplifiers 輸出類型:Digital 輸出功率: THD + 噪聲: 工作電源電壓:3.3 V 電源電流: 最大功率耗散: 最大工作溫度: 安裝風格:SMD/SMT 封裝 / 箱體:TQFP-64 封裝:Reel
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