參數(shù)資料
型號: TDA8932TW
廠商: NXP SEMICONDUCTORS
元件分類: 音頻/視頻放大
英文描述: 25 W, 1 CHANNEL, AUDIO AMPLIFIER, PDSO32
封裝: 6.10 MM, 0.65 MM PITCH, PLASTIC, MO-153, SOT549-1, HTSSOP-32
文件頁數(shù): 21/45頁
文件大小: 285K
代理商: TDA8932TW
TDA8932_1
Koninklijke Philips Electronics N.V. 2006. All rights reserved.
Preliminary data sheet
Rev. 01 — 11 May 2006
28 of 45
Philips Semiconductors
TDA8932
Class-D audio amplier
Equation 10 shows the relation between the maximum allowable power dissipation P and
the thermal resistance from junction to ambient.
(10)
Where:
Rth(j-a) = thermal resistance from junction to ambient
Tj(max) = maximum junction temperature
Tamb = ambient temperature
P = power dissipation which is determined by the efciency of the TDA8932
The power dissipation is shown in Figure 21 (SE) and Figure 28 (BTL).
The thermal resistance as a function of the PCB area (35
m copper) is shown in
Example 1
At VP = 30 V and Po =2 × 15 W into 8 (THD+N = 10 % continuous), the power
dissipation P = 2.3 W at Po = 15 W (see Figure 21).
Tj(max) = 125 °C and Tamb =25 °C.
The required thermal resistance Rth(j-a) = 100 / 2.3 = 43 K/W.
(1) Single layer FR2 PCB; copper plane at device side (100 % coverage).
(2) Double layer FR4 PCB; copper plane on both sides (100 % coverage).
Fig 12. Thermal resistance as a function of the PCB area
R
th j
a
()
T
j max
()
T
amb
P
------------------------------------
=
PCB area (mm2)
0
10000
8000
4000
6000
2000
001aae336
40
60
80
Rth(j-a)
(K/W)
20
(1)
(2)
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