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參數(shù)資料
| 型號： | TDA8932TW |
| 廠商： | NXP SEMICONDUCTORS |
| 元件分類： | 音頻／視頻放大 |
| 英文描述： | 25 W, 1 CHANNEL, AUDIO AMPLIFIER, PDSO32 |
| 封裝： | 6.10 MM, 0.65 MM PITCH, PLASTIC, MO-153, SOT549-1, HTSSOP-32 |
| 文件頁數(shù)： | 20/45頁 |
| 文件大?。?/td> | 285K |
| 代理商： | TDA8932TW |
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TDA8932_1
Koninklijke Philips Electronics N.V. 2006. All rights reserved.
Preliminary data sheet
Rev. 01 — 11 May 2006
27 of 45
Philips Semiconductors
TDA8932
Class-D audio amplier
(9)
Where:
REQ = equivalent resistance []
R3 = parallel resistor [
]
Zi = internal input impedance
Example:
Substituting R1 = R2 = 4.7 k
,Z
i = 100 k and R3=22k in Equation 8 and Equation 9
results in a gain of Gv(tot) = 26.3 dB.
14.6 Device synchronization
If two or more TDA8932 devices are used in one application it is recommended that all
devices are synchronized running at the same switching frequency to avoid beat tones.
Synchronization can be realized by connecting all OSCIO pins together and congure one
of the TDA8932 devices as master, while the other TDA8932 devices are congured as
slave (see Figure 11).
A device is congured as master when connecting a resistor between pins OSCREF and
VSSD(HW) setting the carrier frequency. Pin OSCIO of the master is then congured as an
oscillator output for synchronization. The OSCREF pins of the slave devices should be
shorted to VSSD(HW) conguring pin OSCIO as an input.
14.7 Thermal behavior (printed-circuit board considerations)
The heatsink in the application with the TDA8932 is made with the copper on the
Printed-Circuit Board (PCB). The TDA8932 uses the four corner leads (pins 1, 16, 17 and
32) for heat transfer from the die to the PCB. The thermal foldback will limit the maximum
junction temperature to 140
°C.
R
EQ
R3
Z
i
×
R3
Z
i
+
------------------
=
Fig 11. Master slave concept in two chip application
001aad761
39 k
VSSD
VSSD
Rosc
100 nF
Cosc
IC1
TDA8932
OSCREF
OSCIO
IC2
TDA8932
master
slave
OSCIO
OSCREF
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| TDA8944AJ | 7 W, 2 CHANNEL, AUDIO AMPLIFIER, PZIP17 |
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相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| TDA8933 | 制造商:PHILIPS 制造商全稱:NXP Semiconductors 功能描述:Class-D audio amplifier |
| TDA8933B | 制造商:PHILIPS 制造商全稱:NXP Semiconductors 功能描述:Class D audio amplifier |
| TDA8933BTW | 制造商:PHILIPS 制造商全稱:NXP Semiconductors 功能描述:Class D audio amplifier |
| TDA8933BTW/N2,112 | 功能描述:音頻放大器 Class D audio amplifier 32 leads RoHS:否 制造商:STMicroelectronics 產(chǎn)品:General Purpose Audio Amplifiers 輸出類型:Digital 輸出功率: THD + 噪聲: 工作電源電壓:3.3 V 電源電流: 最大功率耗散: 最大工作溫度: 安裝風格:SMD/SMT 封裝 / 箱體:TQFP-64 封裝:Reel |
| TDA8933BTW/N2,118 | 功能描述:音頻放大器 Class D audio amplifier 32 leads RoHS:否 制造商:STMicroelectronics 產(chǎn)品:General Purpose Audio Amplifiers 輸出類型:Digital 輸出功率: THD + 噪聲: 工作電源電壓:3.3 V 電源電流: 最大功率耗散: 最大工作溫度: 安裝風格:SMD/SMT 封裝 / 箱體:TQFP-64 封裝:Reel |
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